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Adhesives Ingredients
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Description
ERISYS® RDGE-H
Huntsman
ERISYS® RDGE-H by Huntsman is a high purity resorcinol diglycidyl ether, low viscosity aromatic difunctional epoxy resin. It is used in conductive adhesives. It possesses compatibility with all...
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Applications
Adhesives
ERISYS® RF-50
Huntsman
ERISYS® RF-50 by Huntsman is a formulated resorcinol/bisphenol F resin which combines low viscosity with a high degree of reactivity and outstanding chemical resistance. It is non crystallizing and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® RN-25
Huntsman
ERISYS® RN-25 by Huntsman is a non-crystallizing, low viscosity high temperature resorcinol/phenol novolac epoxy resin. It is used in high temperature and conductive adhesives. It provides high degree...
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Applications
Adhesives
ERISYS® RN-3650
Huntsman
ERISYS® RN-3650 by Huntsman is a low viscosity high temperature resorcinol/phenol novolac epoxy resin. It is used in high temperature and conductive adhesives. It provides resistance to crystallization...
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Adhesives
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