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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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17 products match your search
Product Name
Supplier
Description
Cardolite® NX-4764 by Cardolite is low viscosity cashew nutshell resin. Used as reactive modifier. Suitable for solvent-free formulations. Offers increased flexibility while maintaining performance... view more
Cardolite® NX-4956 by Cardolite is low viscosity cashew nutshell resin. Used as reactive modifier for epoxy resins in adhesives. It offers solvent-free formulations, improved cure response, reduced... view more
DESMODUR® E 210 is a solvent-free aromatic polyisocyanate prepolymer by Covestro. It is based on diphenylmethane diisocyanate (MDI). DESMODUR® E 210 is used in reactive adhesives and sealants and in... view more
Aromatic polyisocyanate prepolymer based on diphenylmethane 4,4'- diisocyanate (MDI). Used in reactive adhesives and sealants... view more
DESMODUR® PM 76 by Covestro is a solvent-free prepolymer based on diphenylmethane-4,4'-diisocyanate with isomers and containing ether groups. Used in formulation of reactive adhesives for bonding wood... view more
Mixture of diphenylmethane-4,4'-diisocyanate (MDI) with isomers and homologues. Used in the formulation of solvent free reactive two-component adhesives and moisture curing one-component adhesives... view more
Tetrafunctional polyether polyol containing tertiary amine groups. Used in solvent free reactive adhesives for footwear and automotive. Shows thinning with solvents such as aromatics, ketones and... view more
DYNACOLL® 7210 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
DYNACOLL® 7220 by Evonik is saturated polyester. It increases flexibility, open time, adhesion to non-polar substrates and lowers melt viscosity. It is used in hot melt adhesives and sealants... view more
DYNACOLL® 7230 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. DYNACOLL® 7230 offers benefits such as increases open time, increases flexibility, lowers... view more
DYNACOLL® 7231 by Evonik is saturated polyester. It increases flexibility, open time, adhesion to non-polar substrates and lowers melt viscosity. It is used in hot melt adhesives and sealants... view more
DYNACOLL® 7250 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
Huntsman
ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
Huntsman
ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy... view more
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