Cardolite® NX-4903 by Cardolite is 100% solids, low viscosity and solvent-free phenalkamine. Used as curing agent in epoxy adhesives. Possesses very good penetration and adhesion to damp, wet or dry... view more

Cardolite® NX-4913 by Cardolite is 100% solids, low viscosity and solvent-free phenalkamine. Used as curing agent in epoxy adhesives and sealers for concrete. Possesses very good penetration and... view more

Cardolite® NX-4956 by Cardolite is low viscosity cashew nutshell resin. Used as reactive modifier for epoxy resins in adhesives. It offers solvent-free formulations, improved cure response, reduced... view more

Vinamul® 3479 by Celanese is a surfactant stabilized vinyl acetate, vinyl chloride and ethylene terpolymer dispersion. It exhibits very good block resistance, high bond security, excellent... view more

Exolit® OP 550 by Clariant is a highly effective, reactive, non-halogenated, flame retardant phosphorus polyol. It possesses low functionality and medium viscosity liquid for easy processing. It can be... view more

DESMODUR® E 210 is a solvent-free aromatic polyisocyanate prepolymer by Covestro. It is based on diphenylmethane diisocyanate (MDI). DESMODUR® E 210 is used in reactive adhesives and sealants and in... view more

Aromatic polyisocyanate prepolymer based on diphenylmethane 4,4'- diisocyanate (MDI). Used in reactive adhesives and sealants... view more

DESMODUR® PM 76 by Covestro is a solvent-free prepolymer based on diphenylmethane-4,4'-diisocyanate with isomers and containing ether groups. Used in formulation of reactive adhesives for bonding wood... view more

Mixture of diphenylmethane-4,4'-diisocyanate (MDI) with isomers and homologues. Used in the formulation of solvent free reactive two-component adhesives and moisture curing one-component adhesives... view more

Linear polypropylene polyether polyol. Used in solvent based footwear and automotive adhesives. Shows thinning with solvents such as aromatics, ketones and esters... view more