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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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55 products match your search
Product Name
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Cardolite® NX-5567 is phenalkamine Epoxy curing agent that has very low viscosity, faster cure at low temperature, i.e. 0°C and excellent mechanical strengths. It offers high Tg, greater than 110?C... view more
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-8101 by Cardolite is a water-borne epoxy curing agent that has faster cure at room temperature and low temperature. It has demonstrated outstanding adhesion to concretes and metals... view more
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Cardolite® NX-8401 by Cardolite is a water-borne epoxy curing emulsion that has low viscosity and longer pot life. It has demonstrated outstanding adhesion to concretes and metals, excellent... view more
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Elementis
Blend of hydrophobic silica and mineral oil. Acts as a foam control agent. Used in aqueous-, PVA adhesives for book bindings, stamps, labels, writing pads, advertising, window stickers, grouts and... view more
ANCAMINE® 2390 by Evonik is a low viscosity modified amine. It is used in civil engineering applications such as joint sealants and crack bridging. It acts as a curing agent. It provides high tear... view more
Ancamide® 501 by Evonik is an accelerated amidoamine. It acts as a curing agent for liquid epoxy resins. It offers faster cure speed and improved chemical resistance than unmodified amidoamines. It... view more
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable... view more
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low... view more
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8240 by Huntsman is a very low viscosity epoxy phenol novolac resin with low hydrolyzable chloride content and a high degree of reactivity. It is non-crystallizing and compatible with all... view more
EPALLOY® 9237-70 by Huntsman is a very low viscosity, non-crystallizing, modified Bisphenol F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and good chemical resistance... view more
Izel Kimya
IZAMID A 15 by Izel Kimya is an epoxy resin hardener. It is recommended for adhesives, caulks & grouts, flooring compounds, electrical potting and encapsulation. It shows excellent water and... view more
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