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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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232 products match your search
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Cardolite® NC-558 is a low viscosity, solvent and benzyl alcohol free phenalkamine Epoxy curing agent. It has excellent rapid cure properties, even at low temperatures, offers very good chemical... view more
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Cardolite® NX-5454 is phenalkamine epoxy curing agent by Cardolite that has faster cure at low temperature, i.e. 0°C. Utilized as a solvent-free hardener for epoxy adhesives and as a co-curing agent... view more
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-9001 by Cardolite is polyether polyol based on cashew nutshell liquid technology. It offers excellent water resistance resulting in reduced moisture sensitivity and good hydrolytic... view more
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Dynasylan® 1124 by Evonik acts as an adhesion promoter and surface modifier with excellent crosslinking properties. It is a secondary aminofunctional methoxy-silane possessing two symmetric silicon... view more
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Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity... view more
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