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Product Name
Supplier
Description
Araldite® MY 9512
Huntsman
Araldite® MY 9512 by Huntsman is a N,N,N',N'-Tetraglycidyl-4,4'-methylenebisbenzenamine based tetrafunctional epoxy resin. It is an aero grade. It exhibits medium viscosity. Provides outstanding...
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Applications
Adhesives
Electrical & Electronic Bonding>Battery cover sealing & Battery assembly
Electrical & Electronic Bonding>Thermally & Electrically conductive
Electrical & Electronic Bonding>Poting & Encapsulating
...
Araldite® PY 302-2
Huntsman
Araldite® PY 302-2 by Huntsman is a non-crystallizing, unmodified epoxy resin based on bisphenol-A/F. Used in exterior vehicle (OEM), interior vehicle (OEM), vehicle assembly (OEM), structural...
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Applications
Adhesives
Industrial Assembly>Household appliance assembly
Transportation (excl. Automotive)>Truck
Transportation (excl. Automotive)>Marine
...
Araldite® PY 306
Huntsman
Araldite® PY 306 by Huntsman is a distilled, very low viscosity, unmodified epoxy resin based on bisphenol-F. It is an aero grade. Araldite® PY 306 is used in exterior vehicle (OEM), interior...
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Applications
Adhesives
Medical>Medical device assembly
Transportation (excl. Automotive)>Marine
Electrical & Electronic Bonding>Thermally & Electrically conductive
...
Araldite® PY 4122
Huntsman
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include...
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Applications
Adhesives
Sealants
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Motor & Magnet bonding
...
EPALLOY® 7138
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Joint cement / Grouting
...
EPALLOY® 7170
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low...
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Applications
Adhesives
Sealants
Buildings & constructions>Concrete
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8220
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
...
EPALLOY® 8230
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Automotive
Electrical & Electronic Bonding>Poting & Encapsulating
...
EPALLOY® 8250
Huntsman
EPALLOY® 8250 by Huntsman is a low viscosity epoxy phenol novolac resin. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. EPALLOY® 8250 is used...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Automotive
Buildings & constructions
EPALLOY® 8330
Huntsman
EPALLOY® 8330 by Huntsman is a epoxy phenol novolac resin exhibiting lower viscosity than competitively available commercial alternates. It is non-crystallizing and compatible with all standard curing...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8350
Huntsman
EPALLOY® 8350 by Huntsman is epoxy phenol novolac resin exhibiting slightly higher viscosity. It is non-crystallizing and compatible with all standard curing agents and most resin systems and...
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Applications
Adhesives>Hot-melt adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8370
Huntsman
EPALLOY® 8370 by Huntsman is epoxy phenol novolac resin exhibiting slightly lower viscosity. It is compatible with all standard curing agents and most resin systems and solvents. It has low...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 8370 A85
Huntsman
EPALLOY® 8370 A85 by Huntsman is epoxy phenol novolac resin (85% solids in acetone). It combines low hydrolyzable chloride content with good reactivity. It is compatible with all standard curing agents...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
EPALLOY® 9000
Huntsman
EPALLOY® 9000 by Huntsman is epoxy resin based on tris-hydroxy phenyl ethane, exhibiting very low melt viscosity. It helps to produce very hard cured compositions with high thermal and chemical...
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Applications
Adhesives
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® GE-22
Huntsman
ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses...
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Applications
Adhesives>Reactive adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Automotive
Industrial Assembly
...
ERISYS® GE-24
Huntsman
ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy...
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Applications
Adhesives>Reactive adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Buildings & constructions>Joint cement / Grouting
Electrical & Electronic Bonding>Poting & Encapsulating
...
ERISYS® GE-29
Huntsman
ERISYS® GE-29 by Huntsman is a low viscosity, epoxidized brominated neopentyl glycol. It is used as a diluent and as a flame retardant for epoxy formulations in adhesives. It offers compatibility with...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ERISYS® GE-30
Huntsman
ERISYS® GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
Industrial Assembly
...
ERISYS® RF-50
Huntsman
ERISYS® RF-50 by Huntsman is a formulated resorcinol/bisphenol F resin which combines low viscosity with a high degree of reactivity and outstanding chemical resistance. It is non crystallizing and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
Flexibilizer® DY 965
Huntsman
Flexibilizer® DY 965 by Huntsman is a liquid phenol terminated polyurethane adduct. It acts as an adhesion promoter. Improves the adhesion on metals and has good impact resistance as well as...
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Applications
Adhesives
Transportation (excl. Automotive)>Marine
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Truck
...
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