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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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37 products match your search
Product Name
Supplier
Description
A&C Catalysts
Technicure® LC-100 by A&C Catalysts is an encapsulated modified imidazole designed for one-component epoxy formulations. It can be used as a sole curing agent or as an accelerator for dicyandiamide, anhydride... view more
Irgastat® P 16 by BASF is a permanent, non-migratory anti-static agent. It is a polymeric system based on polyamide and polyether block amides. Used in hot-melt adhesives and sealants for plastics... view more
Melapur™ MC25 by BASF is an effective flame retardant. It offers good mechanical properties and lower specific gravity compared to compounds containing halogen & antimony flame retardant systems... view more
Eastek™ 5545 polymer by Eastman is a high-performance polyester resin. It offers reduced viscosity, increased Tg and enhanced UV resistance. It provides improved formulation compatibility to enable greater... view more
VESTOPLAST® 703 by Evonik is amorphous polyalphaolefin. It possesses low melt viscosity and short open time. It offers excellent foamability. It is used in hot melt adhesives for packaging and... view more
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8250 by Huntsman is a low viscosity epoxy phenol novolac resin. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. EPALLOY® 8250 is used... view more
Huntsman
EPALLOY® 8330 by Huntsman is a epoxy phenol novolac resin exhibiting lower viscosity than competitively available commercial alternates. It is non-crystallizing and compatible with all standard curing... view more
Huntsman
EPALLOY® 8350 by Huntsman is epoxy phenol novolac resin exhibiting slightly higher viscosity. It is non-crystallizing and compatible with all standard curing agents and most resin systems and... view more
IGM Resins
Omnivadd XF 3572 by IGM Resins is a silicone-free anionic surfactant for aqueous systems. It exhibits excellent leveling and anti-cratering properties in most aqueous resin systems. It promotes superior... view more
UNI-REZ™ 2291 by KRATON is a high molecular weight polyamide resin. Exhibits high strength, flexibility, impact resistance, heat resistance under 1 kg load, chemical resistance, excellent adhesion... view more
UNI-REZ™ 2711 by KRATON is polyamide resin. Possesses low viscosity and medium to high softening point. Offers fast set-up and temperature resistance. Provides water resistance and flame resistance... view more
Macroocean
CRYSMELT™ HS171 by Macroocean is a high molecular weight, highly crystalline, saturated linear copolyester resin. It exhibits excellent solvent & chemical resistance and outstanding acid & base... view more
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
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