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Description
Cardolite® NX-5608
Cardolite
Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
...
5
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Cardolite® Ultra LITE 2009
Cardolite
Cardolite® Ultra LITE 2009 is a very low viscosity and very light color phenalkamine epoxy curing agent (Gardener 1) that contains benzyl alcohol. It is specifically designed for improved color...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
Electrical & Electronic Bonding>Poting & Encapsulating
...
2
Documents
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Cardolite® Ultra LITE 2009H
Cardolite
Cardolite® Ultra LITE 2009H is a very low viscosity and very light color phenalkamine epoxy curing agent (Gardener 1) that contains benzyl alcohol. It is specifically designed for improved color...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Transportation (excl. Automotive)
...
2
Documents
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Cardolite® Ultra LITE 2009SF
Cardolite
Cardolite® Ultra LITE 2009SF is a solvent free, very low viscosity and very light color phenalkamine epoxy curing agent. It is specifically designed for improved color stability and light color...
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Applications
Adhesives
Polymers>Epoxies (EP)
Buildings & constructions
Transportation (excl. Automotive)
...
2
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Dynasylan® 1124
Evonik
Dynasylan® 1124 by Evonik acts as an adhesion promoter and surface modifier with excellent crosslinking properties. It is a secondary aminofunctional methoxy-silane possessing two symmetric silicon...
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Applications
Adhesives
Sealants
Polymers>Polyurethanes>PU-Prepolymers
Polymers>Silicones (Si)
...
8
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Dynasylan® 1189
Evonik
Dynasylan® 1189 by Evonik is a bifunctional silane. Acts as an adhesion promoter or as a surface modifier. Provides flexural strength, tensile strength, impact strength, modulus of elasticity...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
10
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Desmocap® 12A
Covestro
Desmocap® 12A by Covestro is a linear aromatic urethane polymer with ether groups. Acts as plasticizer used in combinations of epoxy resins with it may cause turbidity in the cured products. This...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Polymers>Polyurethanes>Isocyanates
...
Accelerator 2950
Huntsman
Accelerator 2950 by Huntsman is a reactive tertiary amine based accelerator with low plasticizing effect. Used as co-hardener when used with polyurethane systems, polyamines, polyamidoamines and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Truck
Transportation (excl. Automotive)>Rail
...
Accelerator 3130
Huntsman
Accelerator 3130 by Huntsman is a non-amine accelerator dissolved in ethanol. It is ideal as drop-in accelerator to cope with cold weather. The ratio of resin to hardener remains unchanged...
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Applications
Adhesives
Polymers>Epoxies (EP)
Polymers>Amines
Medical>Medical device assembly
...
Accelerator 960-1
Huntsman
Accelerator 960-1 by Huntsman is a low viscosity co-hardener or accelerator based on aminophenol. It shortens dust-dry time and full-cure time. The quantity of Accelerator 960-1 added with Araldite®...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Cable Sealing
Electrical & Electronic Bonding>Motor & Magnet bonding
...
Aradur® 140
Huntsman
Aradur® 140 is a BzOH-free, polyamidoimidazoline curing agent by Huntsman. It can formulate heat-resistant epoxy resin mortars. Exhibits very high degrees of adhesion and flexibility along with good...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Battery cover sealing & Battery assembly
Transportation (excl. Automotive)>Marine
...
Aradur® 15-1
Huntsman
Polyamine. Suitable for flexibilizing and hydrophobizing adhesives and mastics. It exhibits low viscosity. Nonylphenol-free. When used along with suitable epoxy resins, it provides improved curing...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Assembly
Electrical & Electronic Bonding>Poting & Encapsulating
...
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