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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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4 products match your search
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VESTAMELT® 171-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more
VESTAMELT® 250-P1 by Evonik is a copolyamide hotmelt adhesive. It offers advantages such as high melting point and high melt viscosity, very good resistance to strike back and very good resistance... view more
Accelerator 1573 by Huntsman is a homogeneous, agglomerate-free dispersion of DICY in liquid epoxy resin. It acts as an accelerator. Easy to manipulate and introduce in epoxy resins formulations... view more
Huntsman
Aradur® 1571 is a dispersion of DICY in liquid epoxy resin by Huntsman. It acts as a hardener. It is a homogeneous, agglomerate-free dispersion. Exhibits accurate and consistent content of... view more
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