VESTAMELT® 753 by Evonik is copolyamide hot-melt adhesive. It used in textile, automotive, electronics and construction industry... view more

VESTAMELT® 755-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, high melt viscosity, good resistance to strike back and well adapted to substrates with... view more

VESTAMELT® 840-P1 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as medium melt viscosity, wide fusing range, high resistance to steam and multipurpose. VESTAMELT® 840-P1... view more

VESTAMELT® 840-P2 by Evonik hot-melt adhesive. It provides benefits such as wide fusing range, high resistance to steam, good adhesion strength and multipurpose grade for different interlinings... view more

Versalink® 740 M by Evonik acts as a high performance diamine curing agent. It is a non-hazardous, off-white powder with wide processing latitude. It has a melting range of 125-128°C and should be... view more