VESTAMELT® 730-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, low melt viscosity and very good adhesion to surfaces difficult to fuse and to silicon... view more

VESTAMELT® 730-P816/20 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, low melt viscosity and very good adhesion to surfaces that are difficult to... view more

VESTAMELT® 732 by Evonik is low melting temperature heat-stabilized copolyamide hotmelt adhesives. It is used in hot-melt dot applications like melt print, aluminum films with textile and easy to... view more

VESTAMELT® 750 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as low melting temperature, wide fixing range, high specific adhesion and reduced tack. VESTAMELT® 750 is used in... view more

VESTAMELT® 750-P1 by Evonik is thermoplastic copolyamide hot-melt adhesives. It possesses good adhesion, good resistance to washing and dry cleaning and decreased tack after coating. VESTAMELT®... view more

VESTAMELT® 750-P2 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, higher melt viscosity and good resistance to strike back. VESTAMELT® 750-P2 shows... view more

VESTAMELT® 750-P3 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point and good resistance to strike back. VESTAMELT® 750-P3 shows good adhesion to face... view more

VESTAMELT® 753 by Evonik is copolyamide hot-melt adhesive. It used in textile, automotive, electronics and construction industry... view more

VESTAMELT® 755-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, high melt viscosity, good resistance to strike back and well adapted to substrates with... view more

VESTAMELT® 840 by Evonik is copolyamide hot-melt adhesive. It is used in textile industry like paste dot, upper dot material double dot. VESTAMELT® 840 offers benefits such as high resistance to... view more

VESTAMELT® 840-P1 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as medium melt viscosity, wide fusing range, high resistance to steam and multipurpose. VESTAMELT® 840-P1... view more

VESTAMELT® 840-P2 by Evonik hot-melt adhesive. It provides benefits such as wide fusing range, high resistance to steam, good adhesion strength and multipurpose grade for different interlinings... view more

VESTOPLAST® 408 by Evonik is a hard grade amorphous polyalphaolefin. It is used in hot melt adhesives for for textile-, paper- and packaging industry. VESTOPLAST® 408 offers very good thermal... view more

Versalink® 740 M by Evonik acts as a high performance diamine curing agent. It is a non-hazardous, off-white powder with wide processing latitude. It has a melting range of 125-128°C and should be... view more

Versalink® P 1000 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as... view more

Versalink® P 250 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It can be blended with other liquid Versalink® curative products to... view more

Versalink® P 650 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It is a liquid at ambient temperatures and can be mixed, cast as well... view more