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Product Name
Supplier
Description
Rhenofit® C
LANXESS
Rhenofit® C by Lanxess is a desiccant in rubber compounds for extruded seals. The composition of this grade is 95% calcium oxide coated with 5% special dispersing agents. It offers prevention of...
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Applications
Sealants
Rhenofit® TRIM/S
LANXESS
Rhenofit® TRIM/S by Lanxess is an activator for peroxide vulcanization in technical molded and extruded seals based on EPDM, EPM and NBR. It is a blend of trimethylolpropane trimethacrylate and...
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Applications
Sealants
Rhenosin® A
LANXESS
Rhenosin® A by Lanxess is a phenol formaldehyde resin with hexamethylene tetramine. It can be used as a reinforcing resin for solid rubbers for oil- resistant seals. Offers compatibility with NR...
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Applications
Sealants
AGITAN® P 833
Munzing
AGITAN® P 833 by Munzing acts as an anti-foaming agent. It is a VOC-free and APE-free grade. It is a blend of liquid hydrocarbons and polyglycols on an inorganic carrier. It is used as a defoamer in...
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Applications
Adhesives
Sealants>Putty
Buildings & constructions
Chemigum® P35
Omnova Solutions (Synthomer)
Chemigum® P35 by Omnova Solutions (Synthomer) is a pre-crosslinked butadiene and acrylonitrile co-polymer. It contains calcium carbonate as a partioning agent. It provides plasticizer retention...
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Applications
Sealants>Pre-formed tape / Gasket
HDK® H20RM
Wacker
HDK® H20RM by Wacker is a synthetic, hydrophobic amorphous silica suitable for epoxy, polyurethane and acrylate systems. It is produced via flame hydrolysis. Acts as a highly effective thickening...
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Applications
Adhesives
Sealants
Pioloform BM 18
Wacker
Pioloform BM 18 by Wacker is polyvinyl butyral resin produced by a reaction between polyvinyl alcohol and butyraldehyde. Compatible with a number of plasticiziers based on esters of phthalic acid...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
Pioloform BS 18
Wacker
Pioloform BS 18 by Wacker is polyvinyl butyral resin produced by a reaction between polyvinyl alcohol and butyraldehyde. Pioloform BS 18 is used as a binder in phenolic adhesives and sealants...
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Applications
Adhesives
Sealants
VINNAPAS® RE 5010 N Discontinued
Wacker
Solvent-free, plasticizer-free, film-forming aid-free, water-redispersible vinyl acetate-ethylene copolymer powder. Used for blending with inorganic binders such as cement, anhydrite, gypsum and...
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Applications
Adhesives
Sealants>Putty
VINNAPAS® RE 5028 N Discontinued
Wacker
Solvent-free, plasticizer-free, film-forming aid-free, water-redispersible vinyl acetate-ethylene copolymer powder. Used for blending with inorganic binders such as cement, anhydrite, gypsum and...
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Applications
Adhesives
Sealants>Putty
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