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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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9 products match your search
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Description
Dynol™ 604 by Evonik is an ultra low-VOC, low-foam, non-ionic wetting agent and surfactant. It is suitable for use in waterborne systems like adhesives and concrete sealants. Possesses low foam... view more
Dynol™ 607 by Evonik is an ethoxylated acetylenic gemini surfactant and substrate wetting agent. It is used in adhesives. It offers very good flow and levelling, no recoatability, non-persistent... view more
Dynol™ 800 by Evonik is a 100% active, non-silicone, non-fluorine, low foam superwetter/surfactant. It contains no added APEs, HAPs or VOCs. It provides a superior balance of properties compared to... view more
Dynol™ 810 by Evonik is a low foam superwetter/surfactant. It is a 100% active grade with no silicone and fluorine content. Contains no added APEs, HAPs or VOCs. It is completely suitable with water... view more
Dynol™ 960 by Evonik is a siloxane based surfactant. It acts as a superwetting agent. Contains no added hazardous air pollutants (HAPs), alkylphenol ethoxylates (APEs) and volatile organic compounds... view more
Surfynol® AS 5000 by Evonik is a non-ionic gemini wetting agent, surfactant and molecular defoamer. It provides multifunctional properties such as surface tension reduction, improved flow, foam... view more
TEGO® Antifoam D 2345 by Evonik is a defoamer and deaerator used in adhesives. It is suitable for solvent-based systems and is based on silicone-free polymer solution. It does not influence the... view more
TEGO® Antifoam D 3020 by Evonik is an organic molecular defoamer based on Gemini surfactant technology. It provides a combination of foam control and dynamic wetting. It is effective at reducing... view more
VESTANAT® IPDI eCO by Evonik is a crosslinking agent which contains 75% renewable carbon per mass balance, that offers a significant reduction in global warming potential (GWP) and CO2 footprint compared... view more
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