Adhesion Resin EP 2325 by Evonik is a polyester resin. It is used in adhesive applications. It acts as an adhesion promoter... view more

Adhesion Resin EP 3350 by Evonik is a special purpose polyester resin of medium hardness for radiation curing systems. It is suitable for improving adhesion to critical substrates. Adhesion Resin EP... view more

Adhesion Resin EP-DS 1300 by Evonik is a polyester resin used in adhesives. It acts as an adhesion promoter. It offers advantages such as improved gloss, flexibility and corrosion protection... view more

Adhesion Resin LTH by Evonik ia polyester resin used in adhesives as an adhesion promoter. It shows high degree of resistance to light and weathering while simultaneously swelling very little in... view more

Adhesion Resin LTW by Evonik is polyester resin. It offers improved flexibility at normal and low temperatures, high light fastness and weather resistance and increased gloss. Adhesion Resin LTW is... view more

Adhesion Resin LTW-B by Evonik is a polyester resin. It acts as an adhesion promoter. It offers benefits such as improved flexibility at normal and low temperatures, highly light-fast and weather... view more

Airase® 4500 Defoamer by Evonik acts as a proprietary organic oil defoamer. It is designed to control and typically eliminates foam, pinholes and entrapped air. It does not contain added mineral... view more

Airase® 4655 Defoamer by Evonik is an organic oil-based defoamer. It does not contain added mineral oils, hazardous air pollutants (HAPs) or alkyl phenol ethoxylates (APEs). It is suitable for... view more

Airase® 5100 Defoamer is a structured siloxane defoamer line (SSDL) defoamer. It can provide an excellent long-term and persistent defoaming in formulations on proper incorporation. It is a low... view more

Airase® 5200 Defoamer by Evonik is a structured siloxane defoamer line (SSDL) defoamer. It is used in waterborne adhesives. It is a solvent, alkyl phenol ethoxylate (APE) as well as HAPs-free and... view more

Airase® 5300 Defoamer by Evonik is a structured siloxane defoamer line (SSDL) defoamer. It is a formulated, solvent, alkyl phenol ethoxylate (APE) free, HAPs-free and easy to handle liquid. It... view more

Airase® 5400 Defoamer by Evonik is a structured siloxane. It acts as a defoamer. Is solvent-, and alkyl phenol ethoxylate (APE)-free. Contributes zero VOC (per EPA method 24) and improved pH... view more

Airase® 5500 Defoamer by Evonik is structured siloxane. It acts as a defoamer. It is solvent-, and alkyl phenol ethoxylate (APE)-free. It contributes zero VOC (per EPA method 24) and improved pH... view more

Airase® 5600 Defoamer by Evonik is a structured siloxane defoamer line (SSDL) defoamer which is free of is solvent, hazardous air pollutants (HAPs) and alkylphenol ethoxylates (APEs). It contributes... view more

Airase® 5655 Defoamer by Evonik is a siloxane-based defoamer. It does not contain added mineral oils, hazardous air pollutants (HAPs) or alkyl phenol ethoxylates (APEs). It is suitable for low-VOC... view more

Airase® 5700 Defoamer by Evonik is structured siloxane. It acts as a defoamer. It is solvent-, and alkyl phenol ethoxylate (APE)-free. Contributes zero VOC (per EPA method 24) and improved pH... view more

Ancamide® 1110 by Evonik is dimethylaminomethylphenol as a curing agent. It offers low viscosity. Ancamide® 1110 is used as a cure catalyst in adhesives... view more

Ancamide® 1638 by Evonik is a very low viscosity curing agent and modifier. Designed for use with liquid epoxy resin cured at ambient or elevated temperature. Also used as an accelerator for other... view more

Ancamide® 2353 by Evonik is a high-performance modified polyamide intended for use with epoxy resins. It acts as a curing agent. It exhibits zero induction time at ambient temperature, excellent... view more

Ancamide® 2396 by Evonik is a modified amidoamine intended for use at ambient temperature with liquid epoxy resins. It acts as a curing agent. It possesses very good chemical resistance and very... view more