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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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79 products match your search
Product Name
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Description
Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature... view more
Tetraethylenepentamine (TEPA) by Huntsman is a curing agent for epoxy resins. It also functions as a corrosion inhibitor, surfactant and mineral processing aid. It is used to produce thermoplastic... view more
Triethylenetetramine (TETA) by Huntsman is triethylenetetramine. It acts as curing agent for epoxy resins. It also functions as a corrosion inhibitor, surfactant and mineral processing aid. It is... view more
VersaCure® RAA 3399 by Huntsman is a high-performance, low-color, low-viscosity, epoxy curing accelerator for use with amine curing agents and polyether amines. It is blended with curing agent... view more
VersaCure® RAC 9089 by Huntsman is a curing agent for liquid epoxy resins. It can also be used as an accelerator in some systems. This low-viscosity & highly reactive modified aliphatic amine offers... view more
VersaCure® RAC 9090 by Huntsman is a low viscosity, curing agent for epoxy systems. This modified aliphatic amine is designed for adhesives and sealants. It is free of benzyl alcohol and... view more
VersaCure® RAC 9950 by Huntsman is a low viscosity, modified cycloaliphatic amine curing agent for epoxy systems. It imparts good mechanical properties, good blush resistance, and excellent surface... view more
VersaCure® RAC 9966 by Huntsman is a mannich-based, curing agent with a fast thin-film set time, even under low temperature and humid conditions. It can be used in conjunction with both standard... view more
Huntsman
Versamid® 115 by Huntsman is a curing agent. It is a high viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins. This resin is useful in adhesive applications. It... view more
Versamid® 115 X 70 by Huntsman is a curing agent for solid or liquid epoxy resins in adhesives. It is xylene solution of high viscosity reactive polyamide resin based on dimerized fatty acid and... view more
Versamid® 115I73 by Huntsman is a curing agent for solid or liquid epoxy resins in adhesives. It is an isopropanol solution of high viscosity reactive polyamide resin based on dimerized fatty acid... view more
Huntsman
Versamid® 125 by Huntsman is a curing agent. It is a medium viscosity, reactive polyamide based on dimerized fatty acid and polyamines. It is designed for use with solid or liquid epoxy resins. It... view more
Huntsman
Versamid® 140 by Huntsman is a curing agent. It is a medium to low viscosity, reactive polyamide. Offers a unique combination of hardness and flexibility, along with the highest chemical and solvent... view more
Huntsman
Versamid® 150 by Huntsman is a curing agent. It is a low viscosity, reactive polyamide based on dimerized fatty acid and polyamines. It is designed for use with solid or liquid epoxy resins. It... view more
Huntsman
Versamid® 228 by Huntsman is a curing agent and surfactant for liquid epoxy resins in waterborne and solvent-free sealants... view more
Huntsman
Versamid® 229 by Huntsman is used as a curing agent for fluid epoxy resins. It is used in adhesives and putties applying under critical atmospheric conditions, on wet surfaces, and even underwater... view more
Versamid® G-490 by Huntsman is a low viscosity, amidoamine curing agent. It has long pot life. It shows instant compatibility with epoxy resins. It provides a wide range of formulation latitudes. It... view more
Huntsman
XTJ -542 by Huntsman is polyetheramine-based adhesion promoter. It is used as an adhesive peel strength promoter. It possesses improved flexibility and low-temperature properties... view more
Accelerator 399 by Huntsman is a partially reactive accelerator. It provides both hydroxyl groups and highly reactive amine groups to increase reaction speed. Accelerator 399 gives the shortest gel... view more
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