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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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199 products match your search
Product Name
Supplier
Description
Daicel
2-Oxepanone homopolymer 2-[2-methyl-(1-oxo-2-propenyl)oxy]-ethylester (HEMA containing 4 mol of caprolactone). It appears colorless or light yellow colored paste... view more
Elementis
DAPRO® W-77 by Elementis is a water-borne interfacial surface tension modifier for adhesive applications. Improves substrate wetting, reduces defects caused by low surface tension additives and... view more
Applications
Elementis
M-P-A® 1078 X by Elementis is a highly efficient, organic rheological additive. It is used as an effective anti-settling and sag control additive for solvent-based coatings. It is particularly... view more
Applications
Bluesil™ TCS 7770 XL & C by Elkem Silicones is a two-component heat curing silicone polymer (50 parts Bluesil™ TCS 7770 XL and 50 parts Bluesil™ TCS 7770 C). Offers good adhesion on silicone coated... view more
Elkem Silicones
CAF® 33 by Elkem Silicones is a non-flowing, black, white translucent, room temperature curing silicone elastomer. Exhibits high temperature resistance, heat stability, good dielectric properties... view more
Elkem Silicones
CAF® 36 PEX by Elkem Silicones is a non-flowing, one-component room temperature vulcanizing silicone elastomer. Exhibits high heat stability (upto 350°C), water & humidity resistance, high... view more
Albisil D-7744 by Evonik is a low exothermic and shrinkage silicone based polymer. It is used in adhesives and sealants. It has ability to be used at very low or high temperatures. Albisil D-7744... view more
Albisil D-7754 by Evonik is a low exothermic and shrinkage silicone base polymer. It is used in flame resistant sealants. Albisil D-7754 has the ability to be used at very low or high temperatures... view more
VESTAMELT® 171-P1 by Evonik is a thermoplastic copolyamide resin. It is a paste additive for low viscosity grades and improves the resistance to strike back. It is suitable for hot-melt adhesive... view more
VESTAMELT® 250-P1 by Evonik is a copolyamide hotmelt adhesive. It offers advantages such as high melting point and high melt viscosity, very good resistance to strike back and very good resistance... view more
FCC INC.
Polyamide wax. Acts as a rheology modifier. It provides excellent thickening, pigment anti-settling and anti-sagging function. It also enhances flake orientation of metallic and pearlescent pigments... view more
Formosa Plastics
Vinyl chloride vinyl acetate copolymer dispersion resin. It has low paste viscosities, excellent heat stability and rapid fusion characteristics. F-40 has been successfully used in mechanically... view more
Formosa Plastics
Vinyl chloride vinyl acetate copolymer dispersion resin. It has low paste viscosities, excellent heat stability and rapid fusion characteristics. F-45 has been successfully used in mechanically... view more
Gelest (Mitsubishi Chemical)
Methoxypolyethoxy (16) methacrylate. Used as copolymerizable non-ionic surfactant in emulsion polymerization applications. Also used in rheology modifiers... view more
Hunan JuRen Chemical New Material Technology
JUREN 2205 (Paste) by Hunan JuRen Chemical New Material Technology is a polycaprolactone diol. It provides excellent binding performances and very good hydrolysis resistance. It is formed by the... view more
Hunan JuRen Chemical New Material Technology
JUREN 2305 by Hunan JuRen Chemical New Material Technology is a low viscosity polycaprolactone diol. It possesses narrow relative molecular weight distribution, high reactivity and low acid value... view more
Hunan JuRen Chemical New Material Technology
JUREN 2305A by Hunan JuRen Chemical New Material Technology is a low viscosity polycaprolactone diol. It possesses narrow relative molecular weight distribution, high reactivity and low acid value... view more
Hunan JuRen Chemical New Material Technology
JUREN 3107 by Hunan JuRen Chemical New Material Technology is a low viscosity polycaprolactone triol. It exhibits high reactivity, narrow relative molecular weight distribution and low acid value... view more
Accelerator 1573 by Huntsman is a homogeneous, agglomerate-free dispersion of DICY in liquid epoxy resin. It acts as an accelerator. Easy to manipulate and introduce in epoxy resins formulations... view more
Huntsman
Aradur® 1571 is a dispersion of DICY in liquid epoxy resin by Huntsman. It acts as a hardener. It is a homogeneous, agglomerate-free dispersion. Exhibits accurate and consistent content of... view more
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