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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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168 products match your search
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VESTAMELT® 750 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as low melting temperature, wide fixing range, high specific adhesion and reduced tack. VESTAMELT® 750 is used in... view more
VESTAMELT® 750-P1 by Evonik is thermoplastic copolyamide hot-melt adhesives. It possesses good adhesion, good resistance to washing and dry cleaning and decreased tack after coating. VESTAMELT®... view more
VESTAMELT® 750-P2 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point, higher melt viscosity and good resistance to strike back. VESTAMELT® 750-P2 shows... view more
VESTAMELT® 750-P3 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as low melting point and good resistance to strike back. VESTAMELT® 750-P3 shows good adhesion to face... view more
VESTAMELT® 750-P816/20 by Evonik is a low melting temperature, copolyamide hot-melt adhesive. It offers good adhesion on difficult substrates. It provides good resistance to washing to 60°C... view more
VESTAMELT® 753 by Evonik is copolyamide hot-melt adhesive. It used in textile, automotive, electronics and construction industry... view more
VESTAMELT® 755 by Evonik is copolyamide hot-melt adhesive. It offers benefits such as low melting temperature, high resistance to strike back, good resistance to washing and wide fixing range... view more
VESTAMELT® 755-P1 by Evonik is copolyamide hot-melt adhesive. It provides benefits such as low melting point, high melt viscosity, good resistance to strike back and well adapted to substrates with... view more
VESTAMELT® 755-P2 by Evonik is a low melting temperature copolyamide hot-melt adhesive. It offers high resistance to strike back. It provides good resistance to washing to 60°C, satisfactory... view more
VESTAMELT® 840 by Evonik is copolyamide hot-melt adhesive. It is used in textile industry like paste dot, upper dot material double dot. VESTAMELT® 840 offers benefits such as high resistance to... view more
VESTAMELT® 840-P1 by Evonik is copolyamide hot-melt adhesive. It offers characteristics such as medium melt viscosity, wide fusing range, high resistance to steam and multipurpose. VESTAMELT® 840-P1... view more
VESTAMELT® 840-P2 by Evonik hot-melt adhesive. It provides benefits such as wide fusing range, high resistance to steam, good adhesion strength and multipurpose grade for different interlinings... view more
VESTAMELT® 840-P816 by Evonik is copolyamide hot-melt adhesive. It provides very good resistance to washing to 60°C, steam and dry-cleaning. It contains an optical brightening agent. VESTAMELT®... view more
VESTAMELT® 930 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, double dot, powder scattering, hot-melt print and extrusion. VESTAMELT® 930 offers high resistance to heat and... view more
VESTAMELT® 940 by Evonik is copolyamide hotmelt adhesive. It is used in paste dot, double dot, powder scattering, powder dot, hot-melt print and extrusion. VESTAMELT® 940 offers high resistance to... view more
VESTAMELT® 970 by Evonik is copolyamide hot-melt adhesive. It is used in manufacture of films and pastes, paste dot and powder dot. VESTAMELT® 970 offers improved resistance to strike back... view more
VESTAMELT® X1010 by Evonik is copolyamide hot-melt adhesive. It is used in stoving paints for self-bonding wires for coil manufacture. VESTAMELT® X1010 offers benefits such as amorphous and high... view more
VESTAMELT® X1017/25 by Evonik is copolyamide hot-melt adhesive. It offers advantages such as high resistance to steam, very low viscosity giving good adhesive properties on difficult surfaces and a... view more
VESTAMELT® X1027 by Evonik is copolyamide hot-melt adhesive. It is used in paste dot, powder dot and colored interlinings. VESTAMELT® X1027 offers advantages such as wide fixing range, high... view more
VESTAMELT X1038 by Evonik is copolyamide hot-melt adhesive with good washing and steam resistance. It shows good adhesion even to substrates on which bonding is difficult... view more
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