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Product Name
Supplier
Description
Black Shield™ Aq. black dispersion 6C11B700973
DyStar
Carbon black aqueous dispersion. Offers high strength and low foaming properties. Mostly used in water based latex adhesives, construction adhesives, automotive structural adhesives, putty...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding
...
Black Shield™ Aq. black dispersion 6C11B701122
DyStar
Carbon black aqueous dispersion. It is easy to use, free flowing and viscosity stable pigment concentrate. Exhibits very good chemical resistance, heat resistance, exterior durability, high jetness...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Polymers>Acrylics & Acrylic Copolymers
Electrical & Electronic Bonding
...
Black Shield™ Aq. black dispersion 6C11B701129
DyStar
Carbon black aqueous dispersion. Possesses very good transfer, gloss retention and hiding power. Mostly used in water based latex adhesives, construction adhesives, automotive structural adhesives...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Polymers>Acrylics & Acrylic Copolymers
Buildings & constructions>General caulking & sealing
...
Black Shield™ Aq. black dispersion 6C11B708005
DyStar
Carbon black aqueous dispersion. Possesses high strength and very good transfer on various paper substrates . Mostly used in water based latex adhesives, construction adhesives, automotive...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Polymers>Acrylics & Acrylic Copolymers
Buildings & constructions>General caulking & sealing
...
Black Shield™ Aq. black dispersion 6C11B709021
DyStar
Carbon black aqueous dispersion. Offers very good transfer, gloss retention and hiding power.Mostly used in water based latex adhesives, construction adhesives, automotive structural adhesives...
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Applications
Adhesives>Water-based adhesives
Sealants>Putty
Polymers>Acrylics & Acrylic Copolymers
Electrical & Electronic Bonding
...
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products matching your search
PHENALLOY® 2860
DynaChem
PHENALLOY® 2860 by DynaChem is a phenol-formaldehyde resol resin in methanol solution. It is suitable for electrical adhesives applications...
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Applications
Adhesives
Electrical & Electronic Bonding
Eastek™ 5545 polymer
Eastman
Eastek™ 5545 polymer by Eastman is a high-performance polyester resin. It offers reduced viscosity, increased Tg and enhanced UV resistance. It provides improved formulation compatibility to enable greater...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Electrical & Electronic Bonding
PE 7600
Electrolube
PE 7600 by Electrolube is a polyester resin. Acts as a flame retardant. Eliminates the use of harmful isocyanates without compromising performance, to create a completely hazard free environment...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Bluesil™ ESA 6024 A & B
Elkem Silicones
Bluesil™ ESA 6024 A & B by Elkem Silicones is a pourable, two component silicone rubber that cures at room temperature by a polyaddition reaction, to a very soft and translucent silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 6120 QC A & B
Elkem Silicones
Bluesil™ ESA 6120 QC A & B by Elkem Silicones is a pourable two components silicone rubber that cures quickly at room temperature by a polyaddition reaction, to a very soft and clear silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 7244 A & B
Elkem Silicones
Bluesil™ ESA 7244 A & B by Elkem Silicones is a liquid two-component, polyaddition heat curing silicone elastomer. It is a solvent-free, self-leveling grade designed for adhesive and sealant...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Industrial Assembly>Household appliance assembly
Automotive
...
Bluesil™ ESA 7250 A & B
Elkem Silicones
Bluesil™ ESA 7250 A & B by Elkem Silicones is a two component, optically clear, high strength silicone elastomer. Cures by a polyaddition reaction at room temperature. Curing can be accelerated by...
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Applications
Sealants
Electrical & Electronic Bonding
Bluesil™ ESA 7252 A & B
Elkem Silicones
Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form...
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Applications
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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SUPER SAP® CCR/CCF
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with fast hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
SUPER SAP® CCR/CCS
Entropy Resins
Epoxy system made of liquid epoxy resin mixed with slow hardener. It contains bio renewable materials sourced as co-products or waste streams of other industrial processes, such as wood pulp and bio...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
1,7-Octadiene
Evonik
1,7-Octadiene by Evonik acts as a cross-linker for polyolefins (PE and PP) and as well as for a number of other polymers. It complies with REACH. It is used in adhesives & sealants...
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Applications
Adhesives
Sealants
Polymers>Polyolefins
Papers & Packagings
...
ALBIFLEX® 296
Evonik
ALBIFLEX® 296 by Evonik is a flexible Bisphenol-A-epoxy-silicone block copolymer. It provides adhesion on many substrates, high mechanical strength and chemical resistance. It offers high elasticity...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
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DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H25
Gelest (Mitsubishi Chemical)
DMS -H25 by Gelest (Mitsubishi Chemical) is hydride terminated polydimethylsiloxane. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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N006-010-P
Global Graphene Group
Fine greyish-black carbon in powder form. It is ~10-20 nm in thickness, and has the approximate x-y dimensions of 14.0 um. The carbon content is around 97.0%, and the oxygen content is approximately...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
N008-100-N
Global Graphene Group
Fine greyish-black carbon in powder form. It is 50-100 nm in thickness, and x-y dimensions to be, at most, 5 um. The carbon content is approximate to 98.0%, and oxygen content is approximately...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
N008-100-P-10
Global Graphene Group
Fine greyish-black carbon in powder form. It is 15-100 nm in thickness, and x-y dimensions to be, at most, 10 um. The carbon content is approximate to 99.0%, and oxygen content is approximately...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
N008-100-P-40
Global Graphene Group
Fine greyish-black carbon in powder form. It is 50-100 nm in thickness, and x-y dimensions to be, at most, 44 um. The carbon content is approximate to 99.0%, and oxygen content is approximately...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
ONEX MW 1001
Glonatech (ONEX Group)
ONEX MW 1001 by Glonatech ONEX Group is a carboxyl functionalized multi-wall carbon nanotube (MWCNTs). It exhibits excellent dispersability in organic solvents. ONEX MW 1001 is recommended for...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
ONEX MW 1002
Glonatech (ONEX Group)
ONEX MW 1002 by Glonatech ONEX Group is a phenol functionalized multi-wall carbon nanotube (MWCNTs). It exhibits excellent dispersability in organic solvents. ONEX MW 1002 is suitable for...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
ONEX MW 1003
Glonatech (ONEX Group)
ONEX MW 1003 by Glonatech ONEX Group is an amino functionalized multi-wall carbon nanotube (MWCNTs). It possesses excellent dispersability in organic solvents. ONEX MW 1003 is designed for...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
HE3131
Guangdong HaoHui New Materials
HE3131 by Guangdong HaoHui New Materials is a low viscosity aromatic acrylate oligomer. Exhibits weatherability, good adhesion, flexibility, abrasion resistance, low shrinkage & heat and water resistance. It is...
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Applications
Electrical & Electronic Bonding
HP6206
Guangdong HaoHui New Materials
HP6206 by Guangdong HaoHui New Materials is aliphatic urethane acrylate. It is a highly flexible oligomer offering good weatherability. It exhibits good adhesion & flexibility and non-yellowing properties. It is...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
PARAPLEX® G-54
Hallstar
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides volume resistivity and dielectric strength as well as resistance to copper...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Polymers>Synthetic Rubbers
Polymers>Polychlorovinyls (PVC, PVDC)>Polyvinyl Chlorides (PVC)
...
PARAPLEX® G-57
Hallstar
Polyester adipate. Acts as a permanent plasticizer in PVC with good high humidity at elevated temperatures. Provides a balance of the best properties of high and low molecular weight plasticizers...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Polymers>Polychlorovinyls (PVC, PVDC)>Polyvinyl Chlorides (PVC)
Electrical & Electronic Bonding
JLS- MC15
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Polyamides (PA)
Polymers>Synthetic Rubbers
...
JLS- MC25
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
JLS- MC50
Hangzhou JLS Flame Retardants Chemical
Melamine cyanurate, halogen-free. Possesses plate crystal structure. Acts as a flame retardant. It can be used alone or as an effective synergist with other flame retardants. It is compatible with...
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Applications
Adhesives
Sealants
Polymers>Silicones (Si)
Polymers>Polyamides (PA)
...
PES-1069
Heyo Enterprises
PES-1069 is a solventborne high molecular weight & saturated copolyester by Heyo Enterprises. PES-1069 is recommended for PCB adhesives...
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Applications
Adhesives>Solvent based adhesives
Electrical & Electronic Bonding>Printed Circuit Boards (PCB)
A-C® 415
Honeywell
A-C® 415 by Honeywell is an ethylene vinyl acetate copolymer grade with a VA content of 15%. Developed specifically as an adhesive flooding compound between the cable bundle and extruded outer...
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Applications
Adhesives
Electrical & Electronic Bonding
Accelerator 1573
Huntsman
Accelerator 1573 by Huntsman is a homogeneous, agglomerate-free dispersion of DICY in liquid epoxy resin. It acts as an accelerator. Easy to manipulate and introduce in epoxy resins formulations...
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Applications
Adhesives
Polymers>Epoxies (EP)
Medical>Medical device assembly
Automotive>Exterior vehicle (OEM)
...
Accelerator 2950
Huntsman
Accelerator 2950 by Huntsman is a reactive tertiary amine based accelerator with low plasticizing effect. Used as co-hardener when used with polyurethane systems, polyamines, polyamidoamines and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Truck
Transportation (excl. Automotive)>Rail
...
Accelerator 3130
Huntsman
Accelerator 3130 by Huntsman is a non-amine accelerator dissolved in ethanol. It is ideal as drop-in accelerator to cope with cold weather. The ratio of resin to hardener remains unchanged...
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Applications
Adhesives
Polymers>Epoxies (EP)
Polymers>Amines
Medical>Medical device assembly
...
Accelerator 400
Huntsman
Accelerator 400 by Huntsman acts as a curing agent. It is compatible with most amines and can be used in amine-cured epoxy systems. Accelerator 400 is recommended for flooring & potting...
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Applications
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Accelerator 960-1
Huntsman
Accelerator 960-1 by Huntsman is a low viscosity co-hardener or accelerator based on aminophenol. It shortens dust-dry time and full-cure time. The quantity of Accelerator 960-1 added with Araldite®...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Cable Sealing
Electrical & Electronic Bonding>Motor & Magnet bonding
...
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all Huntsman
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