TAGS: Waterborne Adhesives
Hot-melt Adhesives
Bostik will exhibit a range of innovative bonding solutions, including web, elastosol, water-based, hot melt and instant engineering adhesives, at Foam Expo North America to be held in Novi, Michigan, the USA from 25-27 August 2020.
Lightweight and Easy-to-apply Adhesives
At the expo, Bostik will feature lightweight and easy- to- apply web adhesives that are equipped with increasing operational efficiencies. Ideal for textile laminating and foam bonding in automotive, aerospace and assembly applications, these adhesives also possess excellent adhesion to vinyl and polyurethane foams and can impart flame retardancy for needed applications. The adhesives are designed for automated assembly lines, improving overall product quality and aiding in sustainability efforts.
Bostik will also showcase a new line of instant engineering adhesives, Born2Bond, at the show. The adhesive is designed for electronic and micro-assembly applications. These products combine the strength of a structural adhesive with the speed of an instant adhesive, enabling “by-the-dot”, on-demand application. Technical service engineer for Bostik, Cyrielle Kolbecher, will present on the technology during a panel discussion at the Adhesives and Bonding Expo.
New Facility with Adhesive Testing Capabilities
Additionally, the company will also feature its innovative facility in Ann Arbor, Michigan, USA. The new facility provides extensive adhesive testing capabilities, equipment assistance and a one-stop-shop approach to bonding needs, enabling customers to receive comprehensive, accessible solutions.
Speaking in advance of the show, Derek Hofsess, Bostik’s business development manager for global assembly adhesives said, “
Foam Expo is an incredible and unique opportunity to meet professionals spanning the foam industry. We look forward to learning more about their current and future needs and showing how our innovative solutions can address them.”
About Foam Expo
Foam Expo is one of the world’s largest exhibition and educational conferences dedicated to all verticals within the technical foam products and technologies industry. This year, it is co-located with the Adhesives and Bonding Expo.
Source: Bostik