TAGS: Epoxy Adhesives
Master Bond has launched EP21TPHT, a two-component epoxy polysulfide system designed for bonding applications that require toughened and thermally stable bonds resistant to chemicals. It resists temperatures up to 350°F, much higher than typical epoxy polysulfide systems. This room temperature curable adhesive also features convenient handling characteristics with a 1 to 1 mix ratio by weight or volume and an easily flowable mixed viscosity of 5,000-15,000 cps.
High Lap Shear with Low Tensile Modulus
EP21TPHT offers a high lap shear strength of 1,600-1,800 psi and bonds well to a variety of substrates including metals, composites, glass, ceramics, and many rubbers. It is a toughened compound with good elongation of 20-40 percent, and a relatively low tensile modulus of 30,000-50,000 psi at room temperature. The combination of such unique properties makes the adhesive suitable for applications involving thermal cycling and mechanical stresses.
EP21TPHT is an electrically insulative material with a dielectric constant of 3.9 and volume resistivity of more than 1014 ohm-cm at 75°F. The adhesive can withstand exposure to a wide range of chemicals including but not limited to fuels, oils, hydrocarbons and hydraulic fluids. EP21TPHT offers a unique combination of performance properties advantageous in many applications in the aerospace, military, electronic, electrical, and specialty OEM industries. The product is available in double barrel syringes and gun dispensers, half pint, pint, quart or gallon container kits.
Source: Master Bond