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Master Bond Launches Graphene-filled Epoxy Adhesive with High Thermal Conductivity

Published on 2019-04-04. Edited By : SpecialChem

TAGS:  Epoxy Adhesives    

master-bond-graphene-adhesiveMaster Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced dimensional stability.

Advantages of Master Bond’s New Adhesive

  • EP30NG achieves an extraordinary thermal conductivity of 38.15 BTU•in/(ft2•hr•°F) [5.5 W/(m•K)] at room temperature.
  • Its compressive strength measures 22,000-24,000 psi upon cure.
  • It has a low coefficient of thermal expansion of 24-26 x 10-6 in/in/°C and exhibits a Shore D hardness of 85-95.
  • This epoxy system is formulated to cure at room temperature or more rapidly at elevated temperatures.
  • Part A has a thick paste consistency and Part B is a low viscosity liquid.

Especially for Pressure Applied Bonding Applications

According to Rohit Ramnath, Senior Product Engineer, "EP30NG is ideal for bonding applications where some contact pressure can be applied. The minimum bond line thickness is 0.18mm, since graphene nanoparticles tend to agglomerate to form larger particles."

EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. The service temperature range is -60°F to +300°F. The product is available in 30 cc jar kits, 1/2 pint kits, and pint kits.

Source: Master Bond
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