TAGS: UV/EB Cure Adhesives Epoxy Adhesives
Master Bond launches Master Bond UV23FLDC-80TK, a moderate viscosity, cationic type system that offers UV light and heat curing mechanisms. It cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm.
The adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. The system's adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility.
Offers Low-tensile and High-elongation
Master Bond UV23FLDC-80TK has a viscosity of 25,000-50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it well-suited for applications where low stress is critical. The system features excellent electrical insulation with a volume resistivity exceeding 1014 ohm-cm.
Master Bond UV23FLDC-80TK is not susceptible to oxygen inhibition. It bonds well to metals, glass, ceramics and many plastics, including but not limited to acrylics and polycarbonates. It has a service temperature ranging from -80°F to +300°F. It is available in various packaging options, including syringes, ½ pint, pint, quart and gallon containers.
Source: Master Bond