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Adhesives Ingredients

BYK® -A 555

Technical DataSheet | Supplied by Byk (Altana Group)

BYK® -A 555 by Byk Altana Group is a solution of foam-destroying polymers, silicone-free. Acts as a air release agent. It shows a good efficiency in various adhesive applications. BYK® -A 555 should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. Its recommended level is 0.1 - 0.5% based upon total formulation.

BYK® -A 555 Product details

Product Type
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Chemical Composition
Product Status
Applications/ Recommended for
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BYK® -A 555 Properties


Value & Unit
Test Condition
Test Method
Density @ 20°C
xxxx g/ml
Flash point
xx °C
Non-volatile matter
xx %
Refractive index @ 20°C
Last edited Mar 27, 2017
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