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Adhesives Ingredients
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Adhesives Ingredients
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BYK® -A 555

Technical Datasheet | Supplied by BYK
BYK® -A 555 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as a air release agent. It shows a good efficiency in various adhesive applications. BYK® -A 555 should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. Its recommended level is 0.1 - 0.5% based upon total formulation.
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Product Type
  • Defoamers / Anti-foaming Agents > Silicone-free
  • Release Agents
Chemical Composition
Solution of foam-destroying polymers, silicone-free
Product Status
COMMERCIAL
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