BYK® -A 555

BYK® -A 555 by BYK is a solution of foam-destroying polymers, silicone-free. Acts as a air release agent. It shows a good efficiency in various adhesive applications. BYK® -A 555 should be stirred into the resin prior to the addition of other formulation components. Used in solvent-borne and solvent-free adhesives. It is suitable for epoxy systems and PUR systems. Its recommended level is 0.1 - 0.5% based upon total formulation.