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Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
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Amicure® CG-1200G

Technical Datasheet | Supplied by Evonik
Dicyandiamide. Acts as a latent curing agent. Its fine particle size provides enhanced reactivity than coarser grades. Activation temperature of this micronized grade can be easily varied from 355 °F to 203 °F with appropriate accelerator selection. It contains 1.5% of an inert flow control additive to inhibit clumping and improve handling. Offers excellent dispersibility in liquid epoxy resin due to higher levels of flow additive. Used for one-component adhesives. Its recommended usage level (EEW=190) is 4-15 phr.
Product Type
Crosslinking / Curing / Vulcanizing Agents > Amines /Amides > Dicyandiamides
Chemical Composition
Physical Form
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