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Adhesives Ingredients
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Adhesives Ingredients
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Dynasylan® 1122

Technical Datasheet | Supplied by Evonik
Dynasylan® 1122 by Evonik is a bis(3-triethoxysilylpropyl)amine grade. It is an adhesion promoter and a surface modifier. Provides good flexural strength, tensile strength, impact strength and modulus of elasticity. Offers benefits such as improved moisture and corrosion resistance, improved rheological behavior like reduction in viscosity and improved newtonian behavior like higher degree of filling. Dynasylan® 1122 is listed with EINECS/ELINCS, NDSL, PICCS, TSCA, IECSC and ECL. This product has a minimum shelf life of 12 months.
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Dynasylan® 1122
Technical Datasheet | Supplied by Evonik
REQUEST A SAMPLE ORIGINAL DATASHEET CONTACT SUPPLIER
Product Type
Adhesion Promoters > Organofunctional Silanes
Chemical Composition
Bis(trimethoxysilylpropyl)amine
CAS Number
13497-18-2
Physical Form
Liquid
Appearance
Colorless to yellow
Product Status
COMMERCIAL
Applications/ Recommended for
  • Adhesives
  • Sealants
  • Polymers > Silicones (Si)
  • Polymers > Polyamides (PA)
  • Polymers > Polyurethanes > PU-Prepolymers
  • Polymers > Polyolefins
  • Polymers > Acrylics & Acrylic Copolymers
  • Polymers > Ethylene Co-terpolymers - Solids (EVA, EMA)
  • Polymers > Polyvinyl Acetate Emulsions & Derivatives (PVAc)
  • Polymers > Epoxies (EP)
  • Polymers > Polychlorovinyls (PVC, PVDC) > Polyvinyl Chlorides (PVC)
Bio Based
No
Labels/Agency Rating
EINECS/ELINCS,
PICCS,
NDSL,
TSCA,
IECSC,
ECL

Dynasylan® 1122 Properties

Property

Value & Unit
Test Condition
Test Method
Density @ 20°C, DIN 51757
0.97 g/cm3
Viscosity@ 20°C, DIN 53015
5.5 mPa.s
Boiling Point @1013 hPa, ASTM D1120
> 300 °C

Compatiblity with other products

Find products that are predicted to be compatible with Dynasylan® 1122.

This list of compatible products is generated out of estimated HSP values. A practical determination of these HSP values would provide higher certainty.
Learn more about Hansen Solubility Parameters (HSP) and their use in predictive formulation.

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