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EPICLON® HP-7200HH

Technical Datasheet | Supplied by DIC Corporation
EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON® HP-7200HH combines exceptionally good bonding properties and extremely small cure shrinkage. It improves hard and brittle properties. Shows resistance to heat and water.
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Product Type
Epoxies (EP)
Chemical Composition
Epoxy resin with dicyclopentadiene
Product Status
COMMERCIAL
Applications/ Recommended for
  • Adhesives
  • Electrical & Electronic Bonding > Poting & Encapsulating
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