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Adhesives Ingredients

EPICLON® HP-7200HH

Technical DataSheet | Supplied by DIC Corporation

EPICLON® HP-7200HH by DIC Corporation is a high performance dicyclopentadiene based epoxy resin. Designed for use in IC encapsulant and adhesives. Exhibits ductility and flexible toughness. EPICLON® HP-7200HH combines exceptionally good bonding properties and extremely small cure shrinkage. It improves hard and brittle properties. Shows resistance to heat and water.

EPICLON® HP-7200HH Product details

Product Type
xxxxxxxxxxxx
Chemical Composition
xxxxxxxxxxxxxxxxxxxxxxxxx
Product Status
xxxxxxxxxx
Applications/ Recommended for
  • xxxxxxxxx
  • xxxxxxxxxxxxxxxxxxxxxxxxx

EPICLON® HP-7200HH Properties

Property

Value & Unit
Test Condition
Test Method
Epoxy equivalent weight (EEW)
xxxxxxxxx g/eq
Melt Viscosity @ 150°C
xxxxxx dPa.s
Softening Point
xxxxxxx °C
Last edited Jan 22, 2018
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