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Adhesives Ingredients
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Product Name
Supplier
Description
Tinuvin® 622
BASF
Tinuvin® 622 is a high molecular weight oligomeric hindered amine by BASF. Used in hotmelt, reactive, solvent-based and radiation curing adhesives and sealants. Acts as a light stabilizer and...
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Applications
Adhesives>Solvent based adhesives
Adhesives>Radiation Curing (UV/EB) adhesives
Adhesives>Hot-melt adhesives
Sealants
...
Bionox 565
Bioray Chem
Bionox 565 by Bioray Chem is 2,6-di-tert-butyl-4-(4,6-bis(octylthio)-1,3,5-triazin-2-ylamino)phenol. Acts as a high molecular weight, non-staining, multifunctional phenolic antioxidant. Bionox 565 is...
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Applications
Adhesives>Hot-melt adhesives
Adhesives>Solvent based adhesives
Polymers>Polyolefins
Polymers>Synthetic Rubbers
...
AEP
Tosoh
N-aminoethylpiperazine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
DETA
Tosoh
Diethylenetriamine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
EDA
Tosoh
Ethylenediamine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
TEPA
Tosoh
Tetraethylenepentamine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
TETA
Tosoh
Triethylenetetramine. Designed to manufacture thermoplastic polyamide resin used for hot-melt adhesives...
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Applications
Adhesives>Hot-melt adhesives
Polymers>Polyamides (PA)
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