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Adhesives Ingredients
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Product Name
Supplier
Description
GP® 5833
Bakelite Synthetics
GP® 5833 by Bakelite Synthetics is a solid novolac resin with low ionic impurities. Used as as curing agent for epoxy resins. Produces thermoset systems. GP® 5833 provides resistance to chemicals...
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Applications
Adhesives
Polymers>Epoxies (EP)
GP® 834D54
Bakelite Synthetics
GP® 834D54 by Bakelite Synthetics is a benzoxazine resin. Used as as curing agent for epoxy resins. Produces thermoset systems. GP® 834D54 provides resistance to chemicals and heat and a good...
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Applications
Adhesives
Polymers>Epoxies (EP)
Aradur® 835
Huntsman
Aliphatic polyamine adduct. It acts as a curing agent. Exhibits excellent mechanical properties, good salt spray and cathodic disbonding performance...
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Applications
Adhesives
Polymers>Epoxies (EP)
THPA (Tetrahydrophthalic anhydride)
Puyang Tiancheng Chemical
THPA (Tetrahydrophthalic anhydride) by Puyang Tiancheng Chemical is a tetrahydrophthalic anhydride grade. It is soluble in benzene and acetone. It acts as an epoxy resin curing agent. THPA...
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Applications
Adhesives
Polymers>Epoxies (EP)
THPA (Shanghai Deborn)
Shanghai Deborn
THPA by Shanghai Deborn is an epoxy resin-based curing agent. It is available in white-colored flake form. It is suitable for adhesives. THPA is partly soluble in petroleum ether and miscible in...
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Applications
Adhesives
Polymers>Polyesters
Polymers>Epoxies (EP)
YS Polyster TH130
Yasuhara Chemical
YS Polyster TH130 by Yasuhara Chemical is a renewable, terpene phenolic resin. Acts as a tackifier. Provides outstanding tackiness, adhesive performance, improved heat resistance and cohesive properties. Enhances...
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Applications
Adhesives>Hot-melt adhesives>Pressure sensitive (HMPSA)
Sealants
Polymers>Epoxies (EP)
Polymers>Acrylics & Acrylic Copolymers
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