Irganox® 1010 EDS by BASF is an odorless sterically hindered phenolic primary antioxidant. It is highly effective and non-discoloring. Possesses stabilizing properties. Provides benefits such as... view more

Expanded, flexible, ultra-low density thermoplastic hollow microsphere core filled with gas, and surface coated with calcium carbonate. Acts as a filler. Possesses non-friable and shear-stable... view more

Expanded, flexible, ultra-low density thermoplastic hollow microsphere core filled with gas, and surface coated with calcium carbonate. Acts as a filler. Possesses non-friable and shear-stable... view more

Nylon multipolymer resin. Possesses good adhesion to nylon yarns. Offers good abrasion resistance, high tensile strength and elongation. Provides advantages such as high melting point, economical in... view more

Elvamide® 8063 by DuPont is nylon multipolymer resin by DuPont for adhesives. Possesses good adhesion to nylon yarns. Offers good abrasion resistance, high tensile strength and elongation. Provides... view more

KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more

KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more

KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

Methyl methacrylate/ n-butyl methacrylate copolymer. It exhibits low VOC, low viscosity and low molecular weight. Possesses compatibility with alkyd-, cellulosic-, epoxy-, vinyl chloride- and rosin... view more

Poly (methyl methacrylate/ n-butyl methacrylate/ methacrylic acid). It has higher softening point. Exhibits good compatibility with many binders and plasticizers. Shows excellent solubility in a... view more

S-30 by Maruwa is an electrically insulating aluminium nitride. Acts as a ceramic filler. Available in the form of spheres. Possesses high thermal conductivity which is 7 times higher than aluminum... view more

S-50 by Maruwa is a spherical aluminium nitride designed for adhesive applications. Acts as a ceramic filler. Exhibits high thermal conductivity which is 7 times higher than aluminum oxide. S-50... view more

S-80 by Maruwa is an aluminium nitride available in the form of sphere. Acts as a ceramic filler designed for adhesive applications. Exhibits a narrow distribution curve, good surface control, good... view more

Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more