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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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130 products match your search
Product Name
Supplier
Description
Jeffamine® T-3000 Amine is polyetheramine by Huntsman. Acts as a modifier and curative in polyurethane elastomers and foams. Used as an adhesion promoter in epoxy systems. Possesses flexible... view more
Jeffamine® T-5000 Amine is polyetheramine by Huntsman. Used as a co-reactant in epoxy systems where adhesion promotion and flexibility are important. It is a crosslinker for polyurea and co-reactant... view more
Jeffamine® XTJ 512 Amine by Huntsman is a polyetheramine. Used in adhesives, construction, flooring and paving, caulks, sealants, decorative aggregate, polymer concrete and wood consolidation. Acts... view more
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for... view more
Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature... view more
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds... view more
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA... view more
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting... view more
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and... view more
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the... view more
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The... view more
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature... view more
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of... view more
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of... view more
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of... view more
RoyOxy® RAC 9089 by Huntsman is cycloaliphatic amine-based ambient temperature curing agent for liquid epoxy resins. Also acts as an accelerator in some systems. Provides an excellent adhesion to... view more
RoyOxy® RAC 9956 by Huntsman is aliphatic amine-based curing agent for liquid and solid epoxy resins. Offers low viscosity, light color, low shrinkage and good electrical properties... view more
RoyOxy® RAD 948 by Huntsman is a low viscosity aliphatic trifunctional reactive diluent based on trimethylol propane. Also acts as a crosslinking agent. Provides very good reactivity which makes it... view more
Tetraethylenepentamine (TEPA) by Huntsman is a curing agent for epoxy resins. It also functions as a corrosion inhibitor, surfactant and mineral processing aid. It is used to produce thermoplastic... view more
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