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Description
Jeffamine® T-3000 Amine
Huntsman
Jeffamine® T-3000 Amine is polyetheramine by Huntsman. Acts as a modifier and curative in polyurethane elastomers and foams. Used as an adhesion promoter in epoxy systems. Possesses flexible...
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Applications
Adhesives
Polymers>Epoxies (EP)
Jeffamine® T-5000 Amine
Huntsman
Jeffamine® T-5000 Amine is polyetheramine by Huntsman. Used as a co-reactant in epoxy systems where adhesion promotion and flexibility are important. It is a crosslinker for polyurea and co-reactant...
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Applications
Adhesives
Polymers>Epoxies (EP)
Jeffamine® XTJ 512 Amine
Huntsman
Jeffamine® XTJ 512 Amine by Huntsman is a polyetheramine. Used in adhesives, construction, flooring and paving, caulks, sealants, decorative aggregate, polymer concrete and wood consolidation. Acts...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
...
N-aminoethylpiperazine (AEP)
Huntsman
N-aminoethylpiperazine (AEP) by Huntsman Advanced Materials is an N-aminoethylpiperazine. It is an epoxy resin curing agent. N-aminoethylpiperazine (AEP) is used to formulate epoxy systems for...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Omicure® 24EMI
Huntsman
Omicure® 24EMI by Huntsman is a non-crystallizing, low viscosity 2-ethyl-4-methyl imidazole. It is used an accelerator for anhydrides or as the sole hardener for catalytic cures of high temperature...
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Applications
Adhesives
Polymers>Epoxies (EP)
Omicure® DDA 10
Huntsman
Omicure® DDA 10 by Huntsman is micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives, electronic potting and encapsulating compounds...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 5
Huntsman
Omicure® DDA 5 by Huntsman is ultra micronized dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and encapsulting...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® DDA 50
Huntsman
Omicure® DDA 50 by Huntsman is a semi-micronized grade of dicyandiamide. It is used as a curing agent for epoxy resins in one component, prepregs and film adhesives and electronic potting and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-210
Huntsman
Omicure® U-210 by Huntsman an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. Its addition to epoxy/ dicy formulations reduces the...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-24M
Huntsman
Omicure® U-24M by Huntsman is an aromatic substituted urea, intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It is suitable for encapsulation adhesives. The...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-35M
Huntsman
Omicure® U-35M by Huntsman is a micronized cycloaliphatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-405M
Huntsman
Omicure® U-405M by Huntsman is a micronized aromatic substituted urea. It is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-410M
Huntsman
Omicure® U-410M by Huntsman is micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-415M
Huntsman
Omicure® U-415M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Omicure® U-52M
Huntsman
Omicure® U-52M by Huntsman is a micronized aromatic substituted urea. It is used as a latent accelerator in the dicyandiamide cure of epoxy resins in adhesives. It is reduces time and temperature of...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
RoyOxy® RAC 9089
Huntsman
RoyOxy® RAC 9089 by Huntsman is cycloaliphatic amine-based ambient temperature curing agent for liquid epoxy resins. Also acts as an accelerator in some systems. Provides an excellent adhesion to...
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Applications
Adhesives
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
RoyOxy® RAC 9956
Huntsman
RoyOxy® RAC 9956 by Huntsman is aliphatic amine-based curing agent for liquid and solid epoxy resins. Offers low viscosity, light color, low shrinkage and good electrical properties...
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Applications
Adhesives
Polymers>Epoxies (EP)
RoyOxy® RAD 948
Huntsman
RoyOxy® RAD 948 by Huntsman is a low viscosity aliphatic trifunctional reactive diluent based on trimethylol propane. Also acts as a crosslinking agent. Provides very good reactivity which makes it...
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Applications
Adhesives>Reactive adhesives>Solvent free (100% solid) adhesives
Polymers>Epoxies (EP)
Tetraethylenepentamine (TEPA)
Huntsman
Tetraethylenepentamine (TEPA) by Huntsman is a curing agent for epoxy resins. It also functions as a corrosion inhibitor, surfactant and mineral processing aid. It is used to produce thermoplastic...
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Applications
Adhesives>Hot-melt adhesives
Sealants
Polymers>Epoxies (EP)
Polymers>Polyamides (PA)
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