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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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19 products match your search
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DYNACOLL® 7320 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It offers benefits such as shortens open time, increases initial strength and... view more
DYNACOLL® 7321 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It offers benefits such as shortens open time, increases initial strength and... view more
DYNACOLL® 7330 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
DYNACOLL® 7331 by Evonik is saturated copolyester. It is used in moisture curable hot melt adhesives and sealants. It is suitable for automotive, wood-working, bookbinding, packaging, textile and... view more
DYNACOLL® 7340 by Evonik is saturated copolyester. It offers benefits such as shortens open time, increases initial strength and lowers melt viscosity. It is suitable for automotive, wood-working... view more
IGM Resins
Omnirad BDK by IGM Resins is a highly efficient type I photoinitiator. It is used to initiate radical polymerization of unsaturated oligomers such as acrylates after exposure to UV light. It can be... view more
IGM Resins
Omnistab BP 12 by IGM Resins is an UV light absorber and is a derivative of 2 hydroxy benzophenone. It retards photo oxidative degradation. It offers improved property when used in a synergistic... view more
Omnivad® SB Flakes by IGM Resins is an organic filler. It enhances higher gloss, increase color strength and improve cure. It is compatible with radically curable adhesives. Product properties will depend on... view more
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