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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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15 products match your search
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Get Sample
DIC Corporation
EPICLON® 520 by DIC Corporation is a 100% reactive diluent, alkyl phenol mono glycidyl ether. It achieves very lower viscosity when mixed with liquid epoxy resins. EPICLON® 520 is used in concrete... view more
DIC Corporation
Bisphenol F type epoxy resin. It is a liquid resin having excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
EPICLON® 830-S by DIC Corporation is Bisphenol-F based epoxy resin. It contains low hydrolyzable chlorine content. Exhibits excellent workability and moldability due to low viscosity. EPICLON® 830-S... view more
DIC Corporation
Bisphenol F type epoxy resin. It has low tendency for crystallization. Exhibits excellent workability and moldability due to low viscosity. Applications include concrete adhesives... view more
DIC Corporation
EPICLON® 840 by DIC Corporation is a low viscosity bisphenol A type (BPA) epoxy resin. Available in Asian countries. Applications of EPICLON® 840 by DIC Corporation include concrete adhesives... view more
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