The material selection platform
Adhesives Ingredients
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Adhesives Ingredients
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TEGOPAC® Bond 160
Evonik
TEGOPAC® Bond 160 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants where low formulation viscosity or very high filler load is required. Applications include...
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Applications
Adhesives
Sealants
Buildings & constructions>Roofing
Buildings & constructions>Floorcovering
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