TEGOPAC® Bond 160 by Evonik is a silylated polymer used for producing neutral curing adhesives and sealants where low formulation viscosity or very high filler load is required. Applications include... view more

Ancamine® 3456 by Evonik is a formulated aliphatic polyamine adduct designed for use with liquid epoxy resin at ambient temperature. It acts as a curing agent. It offers rapid and highly flexible... view more