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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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8 products match your search
Product Name
Supplier
Description
Huntsman
EPALLOY® 7138 by Huntsman is a very low viscosity, non-crystallizing modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low hydrolyzable... view more
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low... view more
Huntsman
EPALLOY® 7200 by Huntsman is a chemically modified liquid diglycidyl ether of Bisphenol-A epoxy resin. It is completely free of acrylates, designed for fast cure and low temperature applications. It... view more
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8240 by Huntsman is a very low viscosity epoxy phenol novolac resin with low hydrolyzable chloride content and a high degree of reactivity. It is non-crystallizing and compatible with all... view more
Huntsman
EPALLOY® 8250 by Huntsman is a low viscosity epoxy phenol novolac resin. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. EPALLOY® 8250 is used... view more
EPALLOY® 9237-70 by Huntsman is a very low viscosity, non-crystallizing, modified Bisphenol F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and good chemical resistance... view more
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