Cardolite® LITE 2100 by Cardolite is a cashew nutshell liquid modified hydrocarbon resin. It is used as a modifier for epoxy and polyurethane. It is a low viscosity, low color, renewable product... view more

Cardolite® LITE 2100R is a cashew nutshell liquid modified hydrocarbon resin. It is used as a modifier for epoxy and polyurethane. It is a low viscosity, low color, renewable product with high... view more

Cardolite® LITE 513DF by Cardolite is a low viscosity epoxy reactive diluent and modifier based on cashew nutshell liquid (CNSL) technology. It has long hydrophobic aliphatic side chain which... view more

Cardolite® LITE 514HP by Cardolite is a flexible di-functional glycidyl ether epoxy resin based on cashew nutshell liquid technology. It is designed to be used in conjunction with traditional epoxy resins or... view more

Cardolite® NC-513 is a low viscosity, mono-functional epoxy reactive diluent by Cardolite. The long hydrophobic aliphatic side chain of cardanol gives this product a very low viscosity and provides... view more

Tinuvin® 928 by BASF is an UV absorber of the hydroxyphenyl benzotriazole class. Used in hotmelt, reactive, solvent-based, radiation curing & construction adhesives and sealants. Exhibits... view more

Chartwell C-523.71HR by Chartwell International is an increased reactivity hybrid carboxy/ hydroxy functional metal organic adhesion promoter synthesized with a stabilized neutralized metal complex. It provides improved... view more

DESMODUR® E 210 is a solvent-free aromatic polyisocyanate prepolymer by Covestro. It is based on diphenylmethane diisocyanate (MDI). DESMODUR® E 210 is used in reactive adhesives and sealants and in... view more

Aromatic polyisocyanate prepolymer based on diphenylmethane 4,4'- diisocyanate (MDI). Used in reactive adhesives and sealants... view more

DESMODUR® PM 76 by Covestro is a solvent-free prepolymer based on diphenylmethane-4,4'-diisocyanate with isomers and containing ether groups. Used in formulation of reactive adhesives for bonding wood... view more

Mixture of diphenylmethane-4,4'-diisocyanate (MDI) with isomers and homologues. Used in the formulation of solvent free reactive two-component adhesives and moisture curing one-component adhesives... view more

It is a solvent-free saturated polyester resin. Desmophen® S-1011-55 provides excellent solvent resistance and also good low temperature properties. It is a high specification grade general purpose... view more

VESTOPLAST® 206 by Evonik is a silane modified polyalphaolefin. It is characterized by its excellent adhesion to a wide range of plastics (polypropylene, polyester and polyamide), to wood, glass... view more

ERISYS® GE-10 by Huntsman is a low viscosity, aromatic, mono-epoxide, ortho cresol glycidyl ether. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more

ERISYS® GE-21 by Huntsman is low viscosity, aliphatic, diepoxide, epoxidized butanediol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses compatibility at... view more

ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more

ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy... view more