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Description
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2709
Evonik
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 2781
Evonik
Ancamide® 2781 by Evonik is a versatile hardener designed to cure epoxy resin at elevated temperatures. It provides longer working time, low exotherm and low viscosity. Ancamide® 2781 is recommended...
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Applications
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 801
Evonik
Ancamide® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
EMS -622
Gelest (Mitsubishi Chemical)
EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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all Gelest (Mitsubishi Chemical)
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