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Product Name
Supplier
Description
DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
EMS -622
Gelest (Mitsubishi Chemical)
EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -013
Gelest (Mitsubishi Chemical)
HMS -013 by Gelest (Mitsubishi Chemical) is 0.5-1.0% (Methylhydrosiloxane) 99-99.5% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -031
Gelest (Mitsubishi Chemical)
HMS -031 by Gelest (Mitsubishi Chemical) is 3-4% (Methylhydrosiloxane) and 96-7% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -064
Gelest (Mitsubishi Chemical)
HMS -064 by Gelest (Mitsubishi Chemical) is 5-7% (Methylhydrosiloxane) and 93-5% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -071
Gelest (Mitsubishi Chemical)
HMS -071 by Gelest (Mitsubishi Chemical) is (6-7% methylhydrosiloxane) and (93-4% dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -082
Gelest (Mitsubishi Chemical)
HMS -082 by Gelest (Mitsubishi Chemical) is (7-9% methylhydrosiloxane) and (91-3% dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -151
Gelest (Mitsubishi Chemical)
HMS -151 by Gelest (Mitsubishi Chemical) is 15-18% (Methylhydrosiloxane) and 82-85% (dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -301
Gelest (Mitsubishi Chemical)
25-35% (Methylhydrosiloxane) 65-70% (dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity: hydrosilylation...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -501
Gelest (Mitsubishi Chemical)
HMS -501 by Gelest (Mitsubishi Chemical) is 50-55% (Methylhydrosiloxane) and 45-50% (dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -H271
Gelest (Mitsubishi Chemical)
HMS -H271 by Gelest (Mitsubishi Chemical) is 25-35% (Methylhydrosiloxane) and 65-70% (dimethylsiloxane) copolymer. This hydride functional polymer undergoes three main classes of reactivity: hydrosilylation...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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