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Product Name
Supplier
Description
DMS -H03
Gelest (Mitsubishi Chemical)
DMS -H03 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H11
Gelest (Mitsubishi Chemical)
DMS -H11 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H21
Gelest (Mitsubishi Chemical)
DMS -H21 by Gelest (Mitsubishi Chemical) is poly (dimethylsiloxane), hydride terminated. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H25
Gelest (Mitsubishi Chemical)
DMS -H25 by Gelest (Mitsubishi Chemical) is hydride terminated polydimethylsiloxane. It undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The silanol...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H31
Gelest (Mitsubishi Chemical)
DMS -H31 by Gelest (Mitsubishi Chemical) is Poly (dimethylsiloxane) hydride terminated. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -H41
Gelest (Mitsubishi Chemical)
DMS -H41 by Gelest (Mitsubishi Chemical) is hydride terminated polydimethylsiloxane. This polymer undergoes three main classes of reactivity: hydrosilylation, dehydrogenative coupling and hydride transfer. The...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -V25R
Gelest (Mitsubishi Chemical)
DMS -V25R by Gelest (Mitsubishi Chemical) is vinyl terminated polydimethylsiloxane. This polymer is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone...
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Applications
Buildings & constructions>Pipes, wires & cables
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -V33
Gelest (Mitsubishi Chemical)
DMS -V33 by Gelest (Mitsubishi Chemical) is vinyl terminated polydimethylsiloxane. This polymer is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Pipes, wires & cables
DMS -V35R
Gelest (Mitsubishi Chemical)
DMS -V35R by Gelest (Mitsubishi Chemical) is vinyl terminated polydimethylsiloxane. This polymer is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Pipes, wires & cables
DMS -V42
Gelest (Mitsubishi Chemical)
DMS -V42 by Gelest (Mitsubishi Chemical) is vinyl terminated polydimethylsiloxane. This polymer is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone...
view more
Applications
Buildings & constructions>Pipes, wires & cables
Electrical & Electronic Bonding>Poting & Encapsulating
DMS -V51
Gelest (Mitsubishi Chemical)
DMS -V51 by Gelest (Mitsubishi Chemical) is Vinyl terminated polydimethylsiloxane. This polymer is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
Buildings & constructions>Pipes, wires & cables
EDV -2022
Gelest (Mitsubishi Chemical)
Vinyl terminated diethylsiloxane - dimethylsiloxane copolymers. It is employed in addition cure (platinum cure) which provides an extremely flexible basis for formulating silicone elastomers. The...
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Applications
Buildings & constructions>Pipes, wires & cables
Electrical & Electronic Bonding>Poting & Encapsulating
EMS -622
Gelest (Mitsubishi Chemical)
EMS -622 by Gelest (Mitsubishi Chemical) is 5-7% (Epoxypropoxypropyl) methylsiloxane-dimethylsiloxane copolymer. The difunctional and multifunctional epoxy silicone includes lower molecular weight siloxane with...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -013
Gelest (Mitsubishi Chemical)
HMS -013 by Gelest (Mitsubishi Chemical) is 0.5-1.0% (Methylhydrosiloxane) 99-99.5% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -031
Gelest (Mitsubishi Chemical)
HMS -031 by Gelest (Mitsubishi Chemical) is 3-4% (Methylhydrosiloxane) and 96-7% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -064
Gelest (Mitsubishi Chemical)
HMS -064 by Gelest (Mitsubishi Chemical) is 5-7% (Methylhydrosiloxane) and 93-5% (dimethyl-siloxane copolymer). This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -071
Gelest (Mitsubishi Chemical)
HMS -071 by Gelest (Mitsubishi Chemical) is (6-7% methylhydrosiloxane) and (93-4% dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -082
Gelest (Mitsubishi Chemical)
HMS -082 by Gelest (Mitsubishi Chemical) is (7-9% methylhydrosiloxane) and (91-3% dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity:...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -151
Gelest (Mitsubishi Chemical)
HMS -151 by Gelest (Mitsubishi Chemical) is 15-18% (Methylhydrosiloxane) and 82-85% (dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
HMS -301
Gelest (Mitsubishi Chemical)
25-35% (Methylhydrosiloxane) 65-70% (dimethylsiloxane) copolymer. This trimethylsiloxy terminated hydride functional polymer undergoes three main classes of reactivity: hydrosilylation...
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Applications
Electrical & Electronic Bonding>Poting & Encapsulating
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