The material selection platform
Adhesives Ingredients
OK
The material selection platform
Adhesives Ingredients
Welcome back
,
My Profile
My Subscriptions
My Courses & Tutorials
Logout
Subscribe to Newsletters
Login / Register
The material selection platform
Adhesives Ingredients
Ingredients Selector
Selection Resources
News & Feeds
SEARCH
OK
Home
Search site
Products Search
by SpecialChem
Share
Feedback
Get link
Copy
Save
Cette page a bien été ajoutée à vos favoris
View all pages saved
CONTINUE BROWSING
Products (
803
)
Documents (
51
)
News (
41
)
REFINE YOUR SEARCH
(
active filters)
9
products match your search
Detailed
List
Product Name
Supplier
Description
AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2709
Evonik
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 2781
Evonik
Ancamide® 2781 by Evonik is a versatile hardener designed to cure epoxy resin at elevated temperatures. It provides longer working time, low exotherm and low viscosity. Ancamide® 2781 is recommended...
view more
Applications
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 801
Evonik
Ancamide® 801 by Evonik is a plasticizer & benzyl alcohol-free, high performance polyamide curing agent. It provides low viscosity, rapid dry times, excellent corrosion resistance, high gloss films...
view more
Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® 903MAV
Evonik
Ancamide® 903MAV by Evonik is an amidoamine curing agent. It is designed for use with liquid epoxy resin. It provides low viscosity, long pot life and pigment acceptance for high build intumescent...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Ancamide® T
Evonik
Ancamide® T by Evonik acts an ambient or elevated temperature curing agent for liquid epoxy resin. It is designed to minimize the undesirable properties of diethylene triamine from which it is...
view more
Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
Back to Top