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Product Name
Supplier
Description
KUREHA Microsphere H1100
Kureha
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H750
Kureha
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H850
Kureha
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
KUREHA Microsphere H950
Kureha
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere M330
Kureha
KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
View
all Kureha
products matching your search
S-30
Maruwa
S-30 by Maruwa is an electrically insulating aluminium nitride. Acts as a ceramic filler. Available in the form of spheres. Possesses high thermal conductivity which is 7 times higher than aluminum...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
S-50
Maruwa
S-50 by Maruwa is a spherical aluminium nitride designed for adhesive applications. Acts as a ceramic filler. Exhibits high thermal conductivity which is 7 times higher than aluminum oxide. S-50...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
S-80
Maruwa
S-80 by Maruwa is an aluminium nitride available in the form of sphere. Acts as a ceramic filler designed for adhesive applications. Exhibits a narrow distribution curve, good surface control, good...
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Applications
Adhesives
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® AG-SL150-16-TRD
Potters Industries
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® AG-SL150-30-TRD
Potters Industries
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
CHS® 18
Progressive Fillers International
CHS® 18 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
CHS® 25
Progressive Fillers International
CHS® 25 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
CHS® 30
Progressive Fillers International
CHS® 30 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve...
view more
Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
CHS® 45
Progressive Fillers International
CHS® 45 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
csgs® 10A
Progressive Fillers International
csgs® 10A is a silver infused glass sphere. Acts as a filler. It not only improves compatibility with conductive film and circuit board applications but physically improves impact strength. Provides...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
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all Progressive Fillers International
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