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Product Name
Supplier
Description
Araldite® DY 91158
Huntsman
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Cable Sealing
Transportation (excl. Automotive)>Aircraft & Aerospace
...
Araldite® PY 4122
Huntsman
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include...
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Applications
Adhesives
Sealants
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Motor & Magnet bonding
...
Suzorite® 200-HK
Imerys
Suzorite® 200-HK by Imerys is a stable, chemically inert, specially delaminated pure phlogopite mica. Possesses great thermal stability, high thermal conductivity, superior mechanical and electrical...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H1100
Kureha
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H750
Kureha
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere H850
Kureha
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
KUREHA Microsphere H950
Kureha
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Buildings & constructions>General caulking & sealing
Electrical & Electronic Bonding>Thermally & Electrically conductive
KUREHA Microsphere M330
Kureha
KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to...
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Applications
Adhesives
Sealants
Electrical & Electronic Bonding>Thermally & Electrically conductive
Buildings & constructions>General caulking & sealing
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products matching your search
Conduct-o-fil® AG-SL150-16-TRD
Potters Industries
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® AG-SL150-30-TRD
Potters Industries
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® SA270S20
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® SA300S20
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone...
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Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
Conduct-o-fil® SA325S20
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone...
view more
Applications
Adhesives>Hot-melt adhesives
Sealants>Pre-formed tape / Gasket
Electrical & Electronic Bonding>Thermally & Electrically conductive
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all Potters Industries
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