OK
The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
Save
Cette page a bien été ajoutée à vos favoris
33 products match your search
Product Name
Supplier
Description
Modified liquid epoxy resin. It is Bisphenol-A based epoxy resin. Exhibits low viscosity. Temperature stable. Suitable for curing epoxy systems. Provides good adhesion. Applications include... view more
Araldite® PY 4122 by Huntsman is a bisphenol-A type epoxy resin. It is a reactive toughener and flexibilizer. Exhibits adhesion, corrosion resistance and abrasion resistance. Applications include... view more
Suzorite® 200-HK by Imerys is a stable, chemically inert, specially delaminated pure phlogopite mica. Possesses great thermal stability, high thermal conductivity, superior mechanical and electrical... view more
KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more
KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more
KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more
KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more
KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more
Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
Potters Industries
Silver-coated aluminum. Used for electronic packaging applications requiring electromagnetic interference (EMI) shielding properties. Provides very good conductivity. Application : silicone... view more
Back to Top