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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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10 products match your search
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Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
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Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a... view more
Contact
Get Sample
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling... view more
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low... view more
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other... view more
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition... view more
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and... view more
Westlake Epoxy
HELOXY™ Modifier 107 by Westlake Epoxy is a viscosity reducing modifier or reactive diluent. It is the diglycidyl ether of cyclohexane dimethanol. It is fully compatible with the entire bisphenol A... view more
Westlake Epoxy
HELOXY™ Modifier 68 by Westlake Epoxy is a viscosity modifier or reactive diluent used for all classes of epoxy resins. It is a diglycidyl ether of neopentyl glycol. It offers improved air release... view more
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