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Description
Cardolite® NX-5607
Cardolite
Cardolite® NX-5607 is phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Buildings & constructions>Concrete
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Cardolite® NX-5608
Cardolite
Cardolite® NX-5608 is a phenalkamine epoxy curing agent that has favorable labeling, faster cure at low temperature, i.e. 0°C. Utilized as a solvent free hardener for epoxy adhesives and as a...
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Applications
Adhesives
Sealants
Polymers>Epoxies (EP)
Transportation (excl. Automotive)
...
5
Documents
Contact
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B-Tough™ UV20
Cargill
B-Tough™ UV20 by Cargill is a bio-based, polyester diacrylate toughening agent. It enhances the viability of production quality parts by improving dimensional stability and anisotropy during curing...
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Applications
Adhesives
Electrical & Electronic Bonding
Bluesil™ ESA 6024 A & B
Elkem Silicones
Bluesil™ ESA 6024 A & B by Elkem Silicones is a pourable, two component silicone rubber that cures at room temperature by a polyaddition reaction, to a very soft and translucent silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 6120 QC A & B
Elkem Silicones
Bluesil™ ESA 6120 QC A & B by Elkem Silicones is a pourable two components silicone rubber that cures quickly at room temperature by a polyaddition reaction, to a very soft and clear silicone gel...
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Applications
Sealants
Electrical & Electronic Bonding
Automotive
Bluesil™ ESA 7244 A & B
Elkem Silicones
Bluesil™ ESA 7244 A & B by Elkem Silicones is a liquid two-component, polyaddition heat curing silicone elastomer. It is a solvent-free, self-leveling grade designed for adhesive and sealant...
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Applications
Adhesives
Sealants>Pre-formed tape / Gasket
Industrial Assembly>Household appliance assembly
Automotive
...
Bluesil™ ESA 7250 A & B
Elkem Silicones
Bluesil™ ESA 7250 A & B by Elkem Silicones is a two component, optically clear, high strength silicone elastomer. Cures by a polyaddition reaction at room temperature. Curing can be accelerated by...
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Applications
Sealants
Electrical & Electronic Bonding
Bluesil™ ESA 7252 A & B
Elkem Silicones
Bluesil™ ESA 7252 A & B by Elkem Silicones is a low viscosity , non-corrosive, two-component silicone elastomer which cures at room temperature by a polyaddition reaction. It is supplied in the form...
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Applications
Sealants
Electrical & Electronic Bonding>Poting & Encapsulating
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AMICURE® 101
Evonik
Amicure® 101 by Evonik is a non-MDA aromatic amine. It is used in heat-cured adhesives. It acts as a curing agent. It possesses non-staining properties. It offers benefits such as good handling...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1769
Evonik
ANCAMINE® 1769 by Evonik is a hydroxyalkylated polyamine based curing agent. It is suitable for potting and casting adhesives. It possesses good mechanical- and electrical properties. It provides low...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 1922A
Evonik
ANCAMINE® 1922A by Evonik is a low viscosity, moderately reactive room temperature curing agent. Used in ambient and heat-cured structural adhesives for aerospace, automotive, electrical, and other...
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Applications
Adhesives
Polymers>Epoxies (EP)
Transportation (excl. Automotive)>Aircraft & Aerospace
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2264
Evonik
ANCAMINE® 2264 by Evonik is an epoxy curing agent with both cycloaliphatic and aromatic amine. It provides increased chemical resistance and faster cure. It possesses higher glass transition...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
ANCAMINE® 2709
Evonik
Ancamine® 2709 by Evonik acts as a tertiary amine based cure accelerator for dicyandiamide and anhydride cured epoxy resin systems. It offers rapid cure at elevated temperatures, low viscosity and...
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Applications
Adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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Omnivadd SF 3777
IGM Resins
Omnivadd SF 3777 by IGM Resins is a silicone-free additive having high molecular weight and very broad compatibility. It reduces the surface tension of various resin systems at the substrate interface. It...
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Applications
Adhesives
Electrical & Electronic Bonding
Bookbinding / graphic art
Omnivadd SP 4009
IGM Resins
Omnivadd SP 4009 by IGM Resins is a multi-purpose high molecular weight wetting and dispersing additive for solvent-based systems. It prevents reflocculation and stabilizes the color strength. It has a...
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Applications
Adhesives
Bookbinding / graphic art
Electrical & Electronic Bonding
Omnivadd SP 4061
IGM Resins
Omnivadd SP 4061 by IGM Resins is a high molecular weight wetting and dispersing additive. It prevents possible co-flocculation and results in improved colour strength, lower viscosity, higher gloss and...
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Applications
Adhesives
Bookbinding / graphic art
Electrical & Electronic Bonding
Omnivadd SP 4063
IGM Resins
Omnivadd SP 4063 by IGM Resins is a high molecular weight wetting and dispersing additive. It prevents reflocculation and stabilizes the color strength. Omnivadd SP 4063 is designed for use in adhesive...
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Applications
Adhesives
Electrical & Electronic Bonding
Bookbinding / graphic art
Omnivadd SP 5001
IGM Resins
Omnivadd SP 5001 by IGM Resins is a cost-effective wetting and dispersing additive. It is a controlled flocculating agent and helps to prevent interfacial tension. It creates thixotropy and therefore...
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Applications
Adhesives
Electrical & Electronic Bonding
Bookbinding / graphic art
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