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Adhesives Ingredients
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Product Name
Supplier
Description
Dianol® 223
Arkema
Dianol® 223 by Arkema is polyether diol. It is a polyol containing primary hydroxyl groups. It provides improved adhesion and exhibits resistance to hydrolysis & high temperature. It remains solid...
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Applications
Buildings & constructions
Automotive
Electrical & Electronic Bonding
Dianol® 320 HP
Arkema
Dianol® 320 HP by Arkema is a polyol, polyether diol containing secondary hydroxyl groups. Provides improved adhesion and resistance to hydrolysis and high temperature. It remains solid at room...
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Applications
Automotive
Electrical & Electronic Bonding
Buildings & constructions
DURANOL™ T4691
Asahi Kasei
DURANOL™ T4691 by Asahi Kasei is a polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows excellent moisture heat & hydrolysis resistance and excellent...
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Applications
Electrical & Electronic Bonding
DURANOL™ T4692
Asahi Kasei
DURANOL™ T4692 by Asahi Kasei is a polycarbonatediol (PCD). Compatible with polyester polyols. It is available in the form of liquid. Offers excellent moisture heat & hydrolysis resistance and...
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Applications
Electrical & Electronic Bonding
DURANOL™ T6001
Asahi Kasei
DURANOL™ T6001 by Asahi Kasei is a flexible polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows high strength retention even after storage at a high...
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Applications
Electrical & Electronic Bonding
DURANOL™ T6002
Asahi Kasei
DURANOL™ T6002 by Asahi Kasei is a flexible, liquid polycarbonatediol (PCD). Compatible with polyester polyols. Exhibits high strength retention even after storage at a high temperature. DURANOL™...
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Applications
Electrical & Electronic Bonding
PHENOLITE TD-2090
DIC Corporation
PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2091
DIC Corporation
PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2093
DIC Corporation
PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2106
DIC Corporation
PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
PHENOLITE TD-2131
DIC Corporation
PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
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Versalink® P 250
Evonik
Versalink® P 250 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It can be blended with other liquid Versalink® curative products to...
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Applications
Adhesives
Sealants
Polymers>Polyurethanes
Electrical & Electronic Bonding>Poting & Encapsulating
...
Araldite® GT 6099
Huntsman
Araldite® GT 6099 by Huntsman is a solid, type 9, bisphenol-A based epoxy resin of high molecular weight. Araldite® GT 6099 is used in exterior vehicle (OEM), interior vehicle (OEM), vehicle...
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Applications
Adhesives
Buildings & constructions>Structural assembly
Electrical & Electronic Bonding>Motor & Magnet bonding
Automotive>Exterior vehicle (OEM)
...
Araldite® GT 7071
Huntsman
Araldite® GT 7071 by Huntsman is a solid, bisphenol-A based epoxy resin of medium molecular weight. Provides optimal flexibility, high impact strength, good all-round chemical resistance. It is...
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Applications
Adhesives
Industrial Assembly>Sporting Goods
Transportation (excl. Automotive)>Marine
Automotive>Vehicle assembly (OEM)
...
Araldite® MT 35600
Huntsman
Araldite® MT 35600 by Huntsman is a bisphenol-A based benzoxazine thermoset resin. It exhibits high temperature resistance, good electrical properties, low water absorption, dimensional stability...
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Applications
Adhesives
Industrial Assembly>Sporting Goods
Electrical & Electronic Bonding>Battery cover sealing & Battery assembly
Electrical & Electronic Bonding>Thermally & Electrically conductive
...
Araldite® MT 35700
Huntsman
Araldite® MT 35700 by Huntsman is a bisphenol-F based benzoxazine. It is a di-functional thermoset resin. Can be homopolymerized or co-reacted with epoxy or phenolic resins to produce polymers with...
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Applications
Adhesives
Industrial Assembly>Household appliance assembly
Transportation (excl. Automotive)>Aircraft & Aerospace
Industrial Assembly>Sporting Goods
...
Omicure® BC-120
Huntsman
Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or...
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Applications
Adhesives
Electrical & Electronic Bonding>Poting & Encapsulating
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all Huntsman
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