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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
by SpecialChem
 
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24 products match your search
Product Name
Supplier
Description
Dianol® 223 by Arkema is polyether diol. It is a polyol containing primary hydroxyl groups. It provides improved adhesion and exhibits resistance to hydrolysis & high temperature. It remains solid... view more
Dianol® 320 HP by Arkema is a polyol, polyether diol containing secondary hydroxyl groups. Provides improved adhesion and resistance to hydrolysis and high temperature. It remains solid at room... view more
Asahi Kasei
DURANOL™ T4691 by Asahi Kasei is a polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows excellent moisture heat & hydrolysis resistance and excellent... view more
Asahi Kasei
DURANOL™ T4692 by Asahi Kasei is a polycarbonatediol (PCD). Compatible with polyester polyols. It is available in the form of liquid. Offers excellent moisture heat & hydrolysis resistance and... view more
Asahi Kasei
DURANOL™ T6001 by Asahi Kasei is a flexible polycarbonatediol (PCD) available in liquid form. Compatible with polyester polyols. Shows high strength retention even after storage at a high... view more
Asahi Kasei
DURANOL™ T6002 by Asahi Kasei is a flexible, liquid polycarbonatediol (PCD). Compatible with polyester polyols. Exhibits high strength retention even after storage at a high temperature. DURANOL™... view more
DIC Corporation
PHENOLITE TD-2090 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Exhibits softening point at 117-123°C and high cross-linking density. Shows high heat-, moisture- and... view more
DIC Corporation
PHENOLITE TD-2091 by DIC Corporation is a phenolic novolac resin designed for encapsulants. Offers softening point at 105-115°C and high cross-linking density. Shows high heat-, moisture- and... view more
DIC Corporation
PHENOLITE TD-2093 by DIC Corporation is a phenolic novolac resin. Provides softening point at 98-102°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more
DIC Corporation
PHENOLITE TD-2106 by DIC Corporation is a phenolic novolac resin. Offers softening point at 88-95°C and high cross-linking density. Shows high heat-, moisture- and chemical resistance. PHENOLITE... view more
DIC Corporation
PHENOLITE TD-2131 by DIC Corporation is phenolic novolac resin. Exhibits high cross-linking density as well as high heat-, moisture- and chemical resistance. Compatible with epoxy resin curing... view more
Versalink® P 250 by Evonik is a low-reactivity aromatic amines for use in polyurea or polyurea-polyurethane hybrid formulations. It can be blended with other liquid Versalink® curative products to... view more
Araldite® GT 6099 by Huntsman is a solid, type 9, bisphenol-A based epoxy resin of high molecular weight. Araldite® GT 6099 is used in exterior vehicle (OEM), interior vehicle (OEM), vehicle... view more
Araldite® GT 7071 by Huntsman is a solid, bisphenol-A based epoxy resin of medium molecular weight. Provides optimal flexibility, high impact strength, good all-round chemical resistance. It is... view more
Araldite® MT 35600 by Huntsman is a bisphenol-A based benzoxazine thermoset resin. It exhibits high temperature resistance, good electrical properties, low water absorption, dimensional stability... view more
Araldite® MT 35700 by Huntsman is a bisphenol-F based benzoxazine. It is a di-functional thermoset resin. Can be homopolymerized or co-reacted with epoxy or phenolic resins to produce polymers with... view more
Omicure® BC-120 by Huntsman is boron trichloride amine complex designed for adhesive applications. It is used as a latent curing agent and accelerator in the aromatic amine, acid anhydride or... view more
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