KUREHA Microsphere H1100 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more

KUREHA Microsphere H750 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

KUREHA Microsphere H850 is a thermally expandable microcapsule. On heating, it expands to a target diameter and maintains that diameter after cooling. This precision additive is used to lower... view more

KUREHA Microsphere H950 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

KUREHA Microsphere M330 is a thermally expandable microcapsule. This precision additive is used to lower density, reduce cost, and provide acoustic and thermal insulation. On heating, it expands to... view more

S-30 by Maruwa is an electrically insulating aluminium nitride. Acts as a ceramic filler. Available in the form of spheres. Possesses high thermal conductivity which is 7 times higher than aluminum... view more

S-50 by Maruwa is a spherical aluminium nitride designed for adhesive applications. Acts as a ceramic filler. Exhibits high thermal conductivity which is 7 times higher than aluminum oxide. S-50... view more

S-80 by Maruwa is an aluminium nitride available in the form of sphere. Acts as a ceramic filler designed for adhesive applications. Exhibits a narrow distribution curve, good surface control, good... view more

Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more

Conductive, hollow ceramic. Possesses low density, lightweight, chemically inertness and very good physical and electrical properties. Enhances dispersion and rheology of resin matrix. Used as... view more

CHS® 18 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve... view more

CHS® 25 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve... view more

CHS® 30 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve... view more

CHS® 45 is a silver infused glass sphere. Acts as a conductive filler. Exhibits very low density with a crush strength of >8,000 psi. It is designed to resist oxidation and cost effectively improve... view more

csgs® 10A is a silver infused glass sphere. Acts as a filler. It not only improves compatibility with conductive film and circuit board applications but physically improves impact strength. Provides... view more