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Adhesives Ingredients
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Adhesives Ingredients
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Omicure® DDA 100
Huntsman
Omicure® DDA 100 by Huntsman is coarse, unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. It is primarily designed for use in solvent-based compositions. Omicure® DDA...
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Applications
Adhesives>Solvent based adhesives
Polymers>Epoxies (EP)
Electrical & Electronic Bonding>Poting & Encapsulating
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