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The material selection platform
Adhesives Ingredients
The material selection platform
Adhesives Ingredients
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105 products match your search
Product Name
Supplier
Description
Huntsman
EPALLOY® 7170 by Huntsman is a very low viscosity, non-crystallizing bisphenol-F modified bisphenol-A resin. It is used in high temperature encapsulants and room curable adhesives. It provides low... view more
Huntsman
EPALLOY® 8220 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It provides low hydrolyzable chloride content, a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8230 by Huntsman is a very low viscosity epoxy phenol novolac and Bisphenol-F resin. It combines low hydrolyzable chlorides with a high degree of reactivity and outstanding chemical... view more
Huntsman
EPALLOY® 8250 by Huntsman is a low viscosity epoxy phenol novolac resin. It is non-crystallizing and compatible with all standard curatives and most epoxy resin systems and solvents. EPALLOY® 8250 is used... view more
Huntsman
EPALLOY® 8330 by Huntsman is a epoxy phenol novolac resin exhibiting lower viscosity than competitively available commercial alternates. It is non-crystallizing and compatible with all standard curing... view more
Huntsman
EPALLOY® 8350 by Huntsman is epoxy phenol novolac resin exhibiting slightly higher viscosity. It is non-crystallizing and compatible with all standard curing agents and most resin systems and... view more
Huntsman
EPALLOY® 8370 by Huntsman is epoxy phenol novolac resin exhibiting slightly lower viscosity. It is compatible with all standard curing agents and most resin systems and solvents. It has low... view more
EPALLOY® 8370 A85 by Huntsman is epoxy phenol novolac resin (85% solids in acetone). It combines low hydrolyzable chloride content with good reactivity. It is compatible with all standard curing agents... view more
Huntsman
EPALLOY® 9000 by Huntsman is epoxy resin based on tris-hydroxy phenyl ethane, exhibiting very low melt viscosity. It helps to produce very hard cured compositions with high thermal and chemical... view more
Huntsman
ERISYS® GE-22 by Huntsman is a low viscosity, cycloaliphatic diepoxide, epoxidized cyclohexanedimethanol. It is used as a reactive diluent for high viscosity epoxy resins in adhesives. It possesses... view more
Huntsman
ERISYS® GE-24 by Huntsman is a low viscosity, relatively high equivalent weight diepoxide of an aliphatic polyglycol. It is used as a diluent and flexibilizer in high viscosity, brittle epoxy... view more
Huntsman
ERISYS® GE-29 by Huntsman is a low viscosity, epoxidized brominated neopentyl glycol. It is used as a diluent and as a flame retardant for epoxy formulations in adhesives. It offers compatibility with... view more
Huntsman
ERISYS® GE-30 by Huntsman is a low viscosity trimethylolpropane triglycidyl ether grade. It is a high epoxy functional resin. It provides very good crosslinking, good reactivity. It can be cured with... view more
Huntsman
ERISYS® RF-50 by Huntsman is a formulated resorcinol/bisphenol F resin which combines low viscosity with a high degree of reactivity and outstanding chemical resistance. It is non crystallizing and... view more
Flexibilizer® DY 965 by Huntsman is a liquid phenol terminated polyurethane adduct. It acts as an adhesion promoter. Improves the adhesion on metals and has good impact resistance as well as... view more
Flexibilizer® XB 3333 by Huntsman is an adhesion promoter. It exhibits an increase in toughness and flexibility in hot curing (>100°C) thermoset formulations. It possesses good solubility in epoxy... view more
GABEPRO™ GPE-221 by Huntsman is 3, 4– epoxycyclohexylmethyl-3' 4'– epoxycyclohexanecarboxylate. Acts as rheology modifier. It is a cycloaliphatic, diepoxy functional compound and the combination of... view more
GABEPRO™ GPE-226 by Huntsman is a 3, 4 – epoxycyclohexylmethyl-3', 4' – epoxycyclohexanecarboxylate. Acts as cycloaliphatic epoxy resin. It reacts in the presence of acid anhydride curing agents at... view more
GABEPRO™ GPE-228 by Huntsman is a bis(3,4- epoxycyclohexylmethyl) adipate. Acts as flexibilizing cycloaliphatic epoxy resin. It reacts in the presence of acid anhydride curing agents at higher. With... view more
Huntsman
HYPOX® DA323 by Huntsman is dimer acid adducted to an epoxidized Bisphenol-A resin. It is usually blended with other epoxy resins and diluents to improve thermal shock and impact resistance... view more
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